Inventor · disambiguated record
Yiu Fai Kwan
Also filed as: KWAN YIU FAI
7 granted patents·3 pending applications·41 citations·filing 2004–2018
80Inventor score
Files withASM ASSEMBLY MATERIALS LTD3KWAN YIU FAI3ASM ASSEMBLY AUTOMATION LTD2ASM TECH SINGAPORE PTE LTD2
Top patents by PatentIndex Score
10 records- 0177US7462926B2Leadframe comprising tin plating or an intermetallic layer formed therefromASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Dec 9, 2008·9 cites·16 claims
- 0266US7125750B2Leadframe with enhanced encapsulation adhesionASM ASSEMBLY MATERIALS LTD·Filed 2004·Granted Oct 24, 2006·17 cites·19 claims
- 0363US7329617B2Coating for enhancing adhesion of molding compound to semiconductor devicesASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Feb 12, 2008·14 cites·21 claims
- 0447US7691679B2Pre-plated leadframe having enhanced encapsulation adhesionASM ASSEMBLY MATERIALS LTD·Filed 2007·Granted Apr 6, 2010·1 cites·12 claims
- 0538US8012886B2Leadframe treatment for enhancing adhesion of encapsulant theretoASM ASSEMBLY MATERIALS LTD·Filed 2007·Granted Sep 6, 2011·0 cites·16 claims
- 0636US10475666B2Routable electroforming substrate comprising removable carrierASM TECH SINGAPORE PTE LTD·Filed 2018·Granted Nov 12, 2019·0 cites·15 claims
- 0735US9847468B1Plated lead frame including doped silver layerASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Dec 19, 2017·0 cites·9 claims
- 0832US2010155260A1Micro-blasting treatment for lead framesKWAN YIU FAI·Filed 2008·Application pending·0 cites
- 0930US2013098659A1Pre-plated lead frame for copper wire bondingKWAN YIU FAI·Filed 2012·Application pending·0 cites
- 1017US2016204003A1Method of forming asper-silver on a lead frameKWAN YIU FAI·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →