Inventor · disambiguated record
Yi-Chang Lee
Also filed as: LEE YI-CHANG
17 granted patents·17 pending applications·98 citations·filing 2003–2021
92Inventor score
Files withCHIPMOS TECHNOLOGIES INC9CHIPMOS TECHNOLOGIES BERMUDA5WANG DAVID WEI5TAIWAN SEMICONDUCTOR MFG CO LTD4LIU AN HONG3
Top patents by PatentIndex Score
34 records- 0191US7973310B2Semiconductor package structure and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Jul 5, 2011·37 cites·44 claims
- 0288US8269352B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·10 cites·13 claims
- 0388US7372286B2Modular probe cardCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted May 13, 2008·17 cites·6 claims
- 0485US7554197B2High frequency IC package and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jun 30, 2009·14 cites·12 claims
- 0582US10515803B1Multiple layer scheme patterning processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
- 0675US10943791B2Pattern formation method and method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 9, 2021·1 cites·20 claims
- 0768US11626292B2Pattern formation method and method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 0868US8269351B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·2 cites·11 claims
- 0968US8264068B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 11, 2012·2 cites·9 claims
- 1068US7368809B2Pillar grid array packageCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted May 6, 2008·4 cites·7 claims
- 1166US7642639B2COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the sameCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jan 5, 2010·3 cites·24 claims
- 1266US7316065B2Method for fabricating a plurality of elastic probes in a rowCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jan 8, 2008·4 cites·5 claims
- 1357US10879070B2Multiple layer scheme patterning processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 1454US2006261230A1Device for removing diseased surface tissuesLEE YI-CHANG·Filed 2005·Application pending·0 cites
- 1546US2007080452A1Bump structure and its forming methodCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 1645US7477065B2Method for fabricating a plurality of elastic probes in a rowCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jan 13, 2009·1 cites·6 claims
- 1744US2011291268A1Semiconductor wafer structure and multi-chip stack structureWANG DAVID WEI·Filed 2010·Application pending·0 cites
- 1844US2011291267A1Semiconductor wafer structure and multi-chip stack structureWANG DAVID WEI·Filed 2010·Application pending·0 cites
- 1943US8550345B2RFID real-time information system accommodated to semiconductor supply chainHUANG CHENG-FANG·Filed 2008·Granted Oct 8, 2013·0 cites·16 claims
- 2043US7696443B2Electronic device with a warped spring connectorCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Apr 13, 2010·0 cites·17 claims
- 2143US2006200180A1Device for removing diseased surface tissuesLEE YI-CHANG·Filed 2005·Application pending·0 cites
- 2241US2006231750A1Image sensor module packageCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 2341US2009236741A1Conductive structure of a chip and method for manufacturing the sameHUANG HSIANG-MING·Filed 2008·Application pending·0 cites
- 2441US2004181185A1Device for removing diseased surface tissuesFiled 2003·Application pending·0 cites
- 2541US2009283905A1Conductive structure of a chipHUANG HSIANG-MING·Filed 2008·Application pending·0 cites
- 2640US2006043538A1Bump structure of an opto-electronic chipCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 2738US2007222465A1Probe head with vertical probes, method for manufacturing the probe head and probe card using the probe headCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 2837US2008124828A1Fabrication processes of a MEMS alloy probeCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 2937US2007085554A1Replaceable modular probe headCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 3034US2006022317A1Chip-under-tape package structure and manufacture thereofLIU AN-HONG·Filed 2005·Application pending·0 cites
- 3134US2013119530A1Thermally enhanced packaging structureLIU AN HONG·Filed 2012·Application pending·0 cites
- 3233US2013049787A1Method of testing stacked semiconductor device structureYI CHI-MING·Filed 2012·Application pending·0 cites
- 3332US2013069228A1Flip-chip package structure and forming method thereofLIU AN-HONG·Filed 2012·Application pending·0 cites
- 3425US7443276B2Electromagnetic coupling galvanic isolated digital output circuit with output feedbackNETIO NETWORKING TECHNOLOGY·Filed 2005·Granted Oct 28, 2008·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →