Inventor · disambiguated record
Ying Rui
Also filed as: RUI YING · RUI YING S
15 granted patents·11 pending applications·159 citations·filing 2002–2025
92Inventor score
Top patents by PatentIndex Score
26 records- 0196US8070925B2Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter targetHOFFMAN DANIEL J·Filed 2008·Granted Dec 6, 2011·36 cites·18 claims
- 0294US8092605B2Magnetic confinement of a plasmaSHANNON STEVEN C·Filed 2006·Granted Jan 10, 2012·37 cites·22 claims
- 0392US10648074B2Physical vapor deposition with isotropic neutral and non-isotropic ion velocity distribution at the wafer surfaceAPPLIED MATERIALS INC·Filed 2019·Granted May 12, 2020·2 cites·18 claims
- 0491US9593411B2Physical vapor deposition chamber with capacitive tuning at wafer supportHOFFMAN DANIEL J·Filed 2012·Granted Mar 14, 2017·8 cites·15 claims
- 0590US7967996B2Process for wafer backside polymer removal and wafer front side photoresist removalAPPLIED MATERIALS INC·Filed 2007·Granted Jun 28, 2011·16 cites·20 claims
- 0689US7879183B2Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2008·Granted Feb 1, 2011·13 cites·25 claims
- 0786US8329593B2Method and apparatus for removing polymer from the wafer backside and edgeYOUSIF IMAD·Filed 2007·Granted Dec 11, 2012·14 cites·17 claims
- 0884US7972968B2High density plasma gapfill deposition-etch-deposition process etchantAPPLIED MATERIALS INC·Filed 2008·Granted Jul 5, 2011·9 cites·19 claims
- 0979US9856558B2Physical vapor deposition method with a source of isotropic ion velocity distribution at the wafer surfaceHOFFMAN DANIEL J·Filed 2008·Granted Jan 2, 2018·3 cites·18 claims
- 1077US7320942B2Method for removal of metallic residue after plasma etching of a metal layerAPPLIED MATERIALS INC·Filed 2002·Granted Jan 22, 2008·19 cites·19 claims
- 1174US10400328B2Physical vapor deposition system with a source of isotropic ion velocity distribution at the wafer surfaceAPPLIED MATERIALS INC·Filed 2017·Granted Sep 3, 2019·0 cites·12 claims
- 1274US8563428B2Methods for depositing metal in high aspect ratio featuresBROWN KARL·Filed 2011·Granted Oct 22, 2013·1 cites·8 claims
- 1368US10971500B2Methods used in the fabrication of integrated circuitryMICRON TECHNOLOGY INC·Filed 2019·Granted Apr 6, 2021·1 cites·23 claims
- 1461US2024224505A1Memory Circuitry And Methods Used In Forming Memory CircuitryMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1556US2010314244A1Ionized Physical Vapor Deposition for Microstructure Controlled Thin Film DepositionAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 1655US2010314245A1Ionized Physical Vapor Deposition for Microstructure Controlled Thin Film DepositionAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 1753US2025280527A1Cell sensing structure and methods of formationMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1852US11189484B2Semiconductor nitridation passivationMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 30, 2021·0 cites·24 claims
- 1948US11011378B2Atom implantation for reduction of compressive stressMICRON TECHNOLOGY INC·Filed 2019·Granted May 18, 2021·0 cites·8 claims
- 2047US2009277874A1Method and apparatus for removing polymer from a substrateAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 2146US2011120505A1Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2011·Application pending·0 cites
- 2245US2009293907A1Method of substrate polymer removalFUNG NANCY·Filed 2008·Application pending·0 cites
- 2344US2007143688A1System and method for mark and navigation to facilitate content viewCHENG JIAN H·Filed 2006·Application pending·0 cites
- 2440US2009191711A1Hardmask open process with enhanced cd space shrink and reductionRUI YING·Filed 2008·Application pending·0 cites
- 2538US2004237997A1Method for removal of residue from a substrateAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 2638US2004229470A1Method for etching an aluminum layer using an amorphous carbon maskAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →