Inventor · disambiguated record
Ying-Tung Wang
Also filed as: WANG YING · WANG YING-TUNG
15 granted patents·8 pending applications·66 citations·filing 2004–2024
91Inventor score
Files withPHOENIX PREC TECHNOLOGY CORP6UNIMICRON TECHNOLOGY CORP3AVARY HOLDING SHENZHEN CO LTD2CHOU STEPHEN Y2HSU SHIH-PING2
Top patents by PatentIndex Score
23 records- 0190US12245358B2Circuit board with embedded electronic component and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2023·Granted Mar 4, 2025·1 cites·18 claims
- 0277US7151050B2Method for fabricating electrical connection structure of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Dec 19, 2006·7 cites·9 claims
- 0376US7350298B2Method for fabricating circuit board with conductive structurePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 1, 2008·7 cites·22 claims
- 0474US12238852B2Circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·7 claims
- 0574US8163657B2Process for adjusting the size and shape of nanostructuresCHOU STEPHEN Y·Filed 2009·Granted Apr 24, 2012·5 cites·30 claims
- 0673US8164003B2Circuit board surface structure and fabrication method thereofTANG SAO-HSIA·Filed 2008·Granted Apr 24, 2012·7 cites·8 claims
- 0769US11570883B2Method for manufacturing a circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·10 claims
- 0869US7341934B2Method for fabricating conductive bump of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Mar 11, 2008·5 cites·15 claims
- 0969US7216424B2Method for fabricating electrical connections of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted May 15, 2007·14 cites·18 claims
- 1068US8163656B2Process for adjusting the size and shape of nanostructuresCHOU STEPHEN Y·Filed 2009·Granted Apr 24, 2012·3 cites·59 claims
- 1167US7659193B2Conductive structures for electrically conductive pads of circuit board and fabrication method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Feb 9, 2010·3 cites·21 claims
- 1266US9423687B2Mask plate, method for fabricating array substrate using the same, and array substrateBOE TECHNOLOGY GROUP CO LTD·Filed 2013·Granted Aug 23, 2016·1 cites·8 claims
- 1366US9111818B2Packaging substrateUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Aug 18, 2015·2 cites·19 claims
- 1464US2025218795A1Method for manufacturing package substratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 1563US7340829B2Method for fabricating electrical connection structure of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Mar 11, 2008·10 cites·11 claims
- 1655US9681536B1Package substrate and method for fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jun 13, 2017·1 cites·15 claims
- 1753US2024234476A9Image sensor structure and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 1850US2024136159A1Metallic Shield For Stable Tape-Frame Substrate ProcessingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1944US2006252247A1Processing apparatus for electroplating conductive bumps on organic circuit boardHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2041US2006252249A1Solder ball pad surface finish structure of circuit board and fabrication method thereofHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 2141US2014239490A1Packaging substrate and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2241US2012175265A1Circuit board surface structure and fabrication method thereofTANG SAO-HSIA·Filed 2012·Application pending·0 cites
- 2338US2012164854A1Packaging substrate and method of fabricating the sameWANG YING-TUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →