Inventor · disambiguated record
Yi-Wen Wu
Also filed as: WU YI-WEN
84 granted patents·11 pending applications·265 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD66TAIWAN SEMICONDUCTOR MFG7WU YI-WEN6HWANG CHIEN LING5LU WEN-HSIUNG3
Top patents by PatentIndex Score
95 records- 0196US9018758B2Cu pillar bump with non-metal sidewall spacer and metal top capHWANG CHIEN LING·Filed 2010·Granted Apr 28, 2015·28 cites·20 claims
- 0296US8441124B2Cu pillar bump with non-metal sidewall protection structureWU YI-WEN·Filed 2010·Granted May 14, 2013·25 cites·20 claims
- 0395US11855028B2Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 0495US8735273B2Forming wafer-level chip scale package structures with reduced number of seed layersLU WEN-HSIUNG·Filed 2011·Granted May 27, 2014·25 cites·20 claims
- 0595US8659155B2Mechanisms for forming copper pillar bumpsCHENG MING-DA·Filed 2010·Granted Feb 25, 2014·33 cites·25 claims
- 0694US11322447B2Dual-sided routing in 3D SiP structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·3 cites·20 claims
- 0794US11101214B2Package structure with dam structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·8 cites·20 claims
- 0893US10297544B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·7 cites·20 claims
- 0991US9601355B2Via structure for packaging and a method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 21, 2017·4 cites·20 claims
- 1091US8242011B2Method of forming metal pillarLIM ZHENG-YI·Filed 2011·Granted Aug 14, 2012·23 cites·20 claims
- 1190US10510673B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 1289US9685372B2Method of forming Cu pillar bump with non-metal sidewall spacer and metal top capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 20, 2017·6 cites·20 claims
- 1388US9305856B2Post-passivation interconnect structure AMD method of forming sameCHEN HSIEN-WEI·Filed 2012·Granted Apr 5, 2016·6 cites·20 claims
- 1488US9030010B2Packaging devices and methodsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 12, 2015·7 cites·20 claims
- 1588US8841766B2Cu pillar bump with non-metal sidewall protection structureHWANG CHIEN LING·Filed 2010·Granted Sep 23, 2014·8 cites·20 claims
- 1688US2025364425A1Package structure with adhesive element over semiconductor chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1787US9099396B2Post-passivation interconnect structure and method of forming the sameWU YI-WEN·Filed 2011·Granted Aug 4, 2015·8 cites·20 claims
- 1886US12388028B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1986US9607921B2Package on package interconnect structureLU WEN-HSIUNG·Filed 2012·Granted Mar 28, 2017·8 cites·17 claims
- 2086US9082776B2Semiconductor package having protective layer with curved surface and method of manufacturing sameLU WEN-HSIUNG·Filed 2012·Granted Jul 14, 2015·7 cites·18 claims
- 2186US8569887B2Post passivation interconnect with oxidation prevention layerHWANG CHIEN LING·Filed 2010·Granted Oct 29, 2013·8 cites·20 claims
- 2285US9935047B2Bonding structures and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 3, 2018·4 cites·20 claims
- 2384US12237262B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 2484US11362010B2Structure and formation method of chip package with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 14, 2022·3 cites·20 claims
- 2584US11302650B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·20 claims
- 2683US10163837B2Cu pillar bump with L-shaped non-metal sidewall protection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·3 cites·20 claims
- 2783US10068853B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 4, 2018·3 cites·12 claims
- 2883US2024379536A1Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2983US2025253253A1Dual-sided routing in 3d semiconductor system-in-package structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3082US12308313B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 3182US12308322B2Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 3282US12051654B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 3382US9859242B2Post-passivation interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·2 cites·20 claims
- 3481US11637054B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 25, 2023·1 cites·20 claims
- 3581US2025079428A1Semiconductor Devices and Methods of ManufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3679US12476198B2Package structure with adhesive element over semiconductor chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 3779US2024363533A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3879US2025364473A1High-density microbump arrays with enhanced adhesion and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3978US9653418B2Packaging devices and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 16, 2017·2 cites·20 claims
- 4078US9287171B2Method of making a conductive pillar bump with non-metal sidewall protection structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 15, 2016·3 cites·20 claims
- 4178US2024379605A1Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MANUFACATURING CO LTD·Filed 2024·Application pending·0 cites
- 4277US12412857B2Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 4377US11901279B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 4477US11804451B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 31, 2023·0 cites·20 claims
- 4577US8823167B2Copper pillar bump with non-metal sidewall protection structure and method of making the sameWU YI-WEN·Filed 2012·Granted Sep 2, 2014·3 cites·20 claims
- 4677US2024178116A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4776US12176337B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 4876US11824007B2Dual-sided routing in 3D SiP structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 4976US10930586B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·1 cites·20 claims
- 5075US11848265B2Semiconductor package with improved interposer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →