Inventor · disambiguated record
Yoshito Akutagawa
Also filed as: AKUTAGAWA YOSHITO
10 granted patents·3 pending applications·88 citations·filing 2004–2020
87Inventor score
Technology areasH10W
Files withFUJITSU SEMICONDUCTOR LTD3FUJITSU MICROELECTRONICS LTD2MATSUI HIROYUKI2TOPPAN PRINTING CO LTD2FUJITSU LTD1
Top patents by PatentIndex Score
13 records- 0193US7884459B2Semiconductor device suitable for a stacked structureFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Feb 8, 2011·23 cites·9 claims
- 0286US8216934B2Semiconductor device suitable for a stacked structureYOSHIDA EIJI·Filed 2010·Granted Jul 10, 2012·7 cites·12 claims
- 0386US7616250B2Image capturing deviceFUJITSU MICROELECTRONICS LTD·Filed 2004·Granted Nov 10, 2009·44 cites·11 claims
- 0471US7638367B2Method of resin sealing electronic partFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Dec 29, 2009·4 cites·10 claims
- 0562US9735099B2Wiring substrate, semiconductor device and method for manufacturing semiconductor deviceTOPPAN PRINTING CO LTD·Filed 2016·Granted Aug 15, 2017·1 cites·14 claims
- 0662US8302843B2Process for producing semiconductor device and apparatus thereforMATSUI HIROYUKI·Filed 2009·Granted Nov 6, 2012·2 cites·5 claims
- 0760US7923303B2Method of resin sealing electronic partFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Apr 12, 2011·1 cites·6 claims
- 0858US7888258B2Forming method of electrode and manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Feb 15, 2011·1 cites·8 claims
- 0952US8411197B2Image pickup device and production method thereofWATANABE NAOYUKI·Filed 2004·Granted Apr 2, 2013·5 cites·11 claims
- 1047US2012251968A1Process for producing semiconductor device and apparatus thereforMATSUI HIROYUKI·Filed 2012·Application pending·0 cites
- 1147US2005167812A1Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1246US11764138B2Glass core device and method of producing the sameTOPPAN PRINTING CO LTD·Filed 2020·Granted Sep 19, 2023·0 cites·7 claims
- 1333US2012129335A1Method of manufacturing semiconductor deviceIKUMO MASAMITSU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →