Inventor · disambiguated record
Youngsik Cho
Also filed as: CHO YOUNGSIK
3 granted patents·8 citations·filing 2008–2009
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0167US8110905B2Integrated circuit packaging system with leadframe interposer and method of manufacture thereofPARK DONGSAM·Filed 2008·Granted Feb 7, 2012·4 cites·20 claims
- 0260US8476775B2Integrated circuit packaging system with embedded interconnect and method of manufacture thereofYANG JOUNGIN·Filed 2009·Granted Jul 2, 2013·4 cites·20 claims
- 0344US7804166B2Integrated circuit package system with stacking moduleSTATS CHIPPAC LTD·Filed 2008·Granted Sep 28, 2010·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →