Inventor · disambiguated record
You Ock Joo
Also filed as: JOO YOU O · JOO YOU-OCK
6 granted patents·4 pending applications·274 citations·filing 2004–2008
87Inventor score
Top patents by PatentIndex Score
10 records- 0196US7700411B2Semiconductor device package and manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Apr 20, 2010·88 cites·10 claims
- 0296US7633170B2Semiconductor device package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Dec 15, 2009·71 cites·16 claims
- 0392US7656047B2Semiconductor device package and manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Feb 2, 2010·49 cites·6 claims
- 0492US7166917B2Semiconductor package having passive component disposed between semiconductor device and substrateADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jan 23, 2007·33 cites·18 claims
- 0585US7439098B2Semiconductor package for encapsulating multiple dies and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Oct 21, 2008·21 cites·20 claims
- 0684US7833837B2Chip scale package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Nov 16, 2010·12 cites·17 claims
- 0745US2008174013A1Semiconductor device package and manufacturing method thereofYANG JUN YOUNG·Filed 2008·Application pending·0 cites
- 0843US2006170096A1Chip scale package and method for manufacturing the sameYANG JUN Y·Filed 2005·Application pending·0 cites
- 0936US2006216868A1Package structure and fabrication thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 1032US2005258518A1Image sensor package module with a leadless leadframe between chipsADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →