Inventor · disambiguated record
Youngchul Kim
Also filed as: KIM YOUNGCHUL
31 granted patents·9 pending applications·147 citations·filing 2007–2024
96Inventor score
Files withSTATS CHIPPAC LTD11HYUNDAI MOTOR CO LTD5KIM YOUNGCHUL4SAMSUNG ELECTRONICS CO LTD3BAE HYUNIL2
Top patents by PatentIndex Score
40 records- 0194US7923290B2Integrated circuit packaging system having dual sided connection and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Apr 12, 2011·35 cites·13 claims
- 0289US10410834B1Reverse power reducing method and plasma power apparatus using the sameNEWPOWERPLASMA CO LTD·Filed 2019·Granted Sep 10, 2019·9 cites·8 claims
- 0388US8313401B2Transmission for hybrid vehicleKIM BAEKYU·Filed 2010·Granted Nov 20, 2012·15 cites·5 claims
- 0487US9287204B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2013·Granted Mar 15, 2016·8 cites·25 claims
- 0586US9252130B2Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Feb 2, 2016·10 cites·27 claims
- 0685US9202715B2Integrated circuit packaging system with connection structure and method of manufacture thereofKIM YOUNGCHUL·Filed 2011·Granted Dec 1, 2015·9 cites·10 claims
- 0784US9245770B2Semiconductor device and method of simultaneous molding and thermalcompression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Jan 26, 2016·7 cites·24 claims
- 0881US7968981B2Inline integrated circuit systemSTATS CHIPPAC LTD·Filed 2008·Granted Jun 28, 2011·8 cites·10 claims
- 0978US9631614B2Oil supply systemHYUNDAI MOTOR CO LTD·Filed 2013·Granted Apr 25, 2017·4 cites·6 claims
- 1078US8501540B2Method for manufacture of inline integrated circuit systemYEE JAE HAK·Filed 2011·Granted Aug 6, 2013·4 cites·5 claims
- 1177US9245772B2Stackable package by using internal stacking modulesSTATS CHIPPAC LTD·Filed 2014·Granted Jan 26, 2016·4 cites·23 claims
- 1276US9240331B2Semiconductor device and method of making bumpless flipchip interconnect structuresSTATS CHIPPAC LTD·Filed 2013·Granted Jan 19, 2016·4 cites·22 claims
- 1375US9721921B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2016·Granted Aug 1, 2017·2 cites·23 claims
- 1475US7800211B2Stackable package by using internal stacking modulesSTATS CHIPPAC LTD·Filed 2007·Granted Sep 21, 2010·8 cites·17 claims
- 1574US10276351B1High-frequency power generator with enhanced pulse functionNEWPOWERPLASMA CO LTD·Filed 2018·Granted Apr 30, 2019·3 cites·6 claims
- 1669US9385100B1Integrated circuit packaging system with surface treatment and method of manufacture thereofLEE HUN TEAK·Filed 2015·Granted Jul 5, 2016·2 cites·14 claims
- 1760US9093415B2Integrated circuit packaging system with heat spreader and method of manufacture thereofKIM OH HAN·Filed 2013·Granted Jul 28, 2015·1 cites·20 claims
- 1860US8906740B2Integrated circuit packaging system having dual sided connection and method of manufacture thereofKO CHAN HOON·Filed 2011·Granted Dec 9, 2014·1 cites·20 claims
- 1960US8403787B2Hydraulic control system of power train for hybrid vehicleKIM YOUNGCHUL·Filed 2010·Granted Mar 26, 2013·3 cites·26 claims
- 2059US9524958B2Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Dec 20, 2016·1 cites·26 claims
- 2158US9559046B2Semiconductor device and method of forming a fan-in package-on-package structure using through silicon viasBAE HYUNIL·Filed 2008·Granted Jan 31, 2017·4 cites·24 claims
- 2258US2025157867A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2356US8816487B2Integrated circuit packaging system with package-in-package and method of manufacture thereofBAE HYUNIL·Filed 2009·Granted Aug 26, 2014·2 cites·16 claims
- 2456US8774996B2Cooling system for cooling driving motor of hybrid vehicle and method for controlling the sameSHIN GWANG SEOB·Filed 2011·Granted Jul 8, 2014·2 cites·4 claims
- 2555US2024193453A1Logical qubit arrangement architecture based on checkerboard and method of moving magic qubit thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 2654US11793772B2Pharmaceutical composition comprising THA as active ingredient for treating breast cancerKOREA UNITED PHARM INC·Filed 2017·Granted Oct 24, 2023·0 cites·4 claims
- 2753US10604003B2Hydraulic pressure supply system of automatic transmission for hybrid vehicle and cooling the jacket of a motor with low pressure supply to low pressure partHYUNDAI MOTOR CO LTD·Filed 2016·Granted Mar 31, 2020·0 cites·4 claims
- 2853US8790207B2Hydraulic control system of automatic transmission for hybrid vehicleSHIN GWANG SEOB·Filed 2011·Granted Jul 29, 2014·1 cites·14 claims
- 2953US2024341035A1Electronic device comprising support body at which coaxial cable is positionedSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3049US11506558B2Apparatus and method for inspecting ventilationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 22, 2022·0 cites·10 claims
- 3148US11201144B2Electrostatic discharge handling for sense IGBT using Zener diodeSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Dec 14, 2021·0 cites·11 claims
- 3245US2014317056A1Method of distributing and storing file-based dataKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 3343US10035152B2Solenoid valveHYUNDAI MOTOR CO LTD·Filed 2016·Granted Jul 31, 2018·0 cites·4 claims
- 3443US2011024890A1Stackable Package By Using Internal Stacking ModulesSTATS CHIPPAC LTD·Filed 2010·Application pending·0 cites
- 3541US2009197517A1Assembling structure of temperature-adjusting doorWANG YOONHO·Filed 2007·Application pending·0 cites
- 3640US2019202278A1Power transmission system of hybrid electric vehicleHYUNDAI MOTOR CO LTD·Filed 2018·Application pending·0 cites
- 3738US8900096B2Method for diagnosing and controlling an unusual hydraulic state of hybrid vehicle transmissionJEONG SANGHYUN·Filed 2012·Granted Dec 2, 2014·0 cites·8 claims
- 3838US2017284558A1Solenoid valveHYUNDAI MOTOR CO LTD·Filed 2016·Application pending·0 cites
- 3934US2015341575A1Defective pixel managing circuit, image sensor module including the same, and defective pixel management methodKIM YOUNGCHUL·Filed 2015·Application pending·0 cites
- 4033US8406962B2Method for determining operating state of element of transmissionKIM YOUNGCHUL·Filed 2011·Granted Mar 26, 2013·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Youngchul Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →