Inventor · disambiguated record
Yong Jae Ko
Also filed as: KO YONG JAE
11 granted patents·1 pending application·63 citations·filing 2010–2025
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0196US8552548B1Conductive pad on protruding through electrode semiconductor deviceDO WON CHUL·Filed 2011·Granted Oct 8, 2013·31 cites·17 claims
- 0292US8487445B1Semiconductor device having through electrodes protruding from dielectric layerDO WON CHUL·Filed 2010·Granted Jul 16, 2013·20 cites·16 claims
- 0387US10410967B1Electronic device comprising a conductive pad on a protruding-through electrodeAMKOR TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·3 cites·20 claims
- 0484US11158582B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Oct 26, 2021·3 cites·19 claims
- 0582US2025309129A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0680US12334450B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 17, 2025·0 cites·13 claims
- 0780US8981572B1Conductive pad on protruding through electrode semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 17, 2015·3 cites·20 claims
- 0879US9431323B1Conductive pad on protruding through electrodeAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·2 cites·20 claims
- 0972US11854991B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 1064US11043458B2Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrodeAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 1162US8900995B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Dec 2, 2014·1 cites·20 claims
- 1257US9947623B1Semiconductor device comprising a conductive pad on a protruding-through electrodeAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 17, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →