Inventor · disambiguated record
Yong Tae Kwon
Also filed as: KWON YONG T · KWON YONG TAE
33 granted patents·13 pending applications·292 citations·filing 1995–2023
96Inventor score
Files withNEPES CO LTD19AUTOTAC INC6CALIFORNIA INST OF TECHN4SEOUL NAT UNIV R&DB FOUNDATION4HYUNDAI ELECTRONICS IND3
Top patents by PatentIndex Score
46 records- 0194US9653397B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2015·Granted May 16, 2017·14 cites·12 claims
- 0293US9502391B2Semiconductor package, fabrication method therefor, and package-on packageNEPES CO LTD·Filed 2013·Granted Nov 22, 2016·21 cites·21 claims
- 0393US6489182B2Method of fabricating a wire arrayed chip size packageHYNIX SEMICONDUCTUR INC·Filed 2001·Granted Dec 3, 2002·81 cites·10 claims
- 0481US11545451B2Semiconductor packageNEPES CO LTD·Filed 2021·Granted Jan 3, 2023·1 cites·20 claims
- 0579US11476211B2Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2020·Granted Oct 18, 2022·1 cites·18 claims
- 0679US6278178B1Integrated device package and fabrication methods thereofHYUNDAI ELECTRONICS IND·Filed 1999·Granted Aug 21, 2001·51 cites·26 claims
- 0778US10804146B2Method for producing semiconductor packageNEPES CO LTD·Filed 2019·Granted Oct 13, 2020·2 cites·20 claims
- 0876US10391067B2Prevention and treatment of neurodegenerative diseases through autophagy activity mediated by a synthetic ligand or arginylated BIP binding to the P62 ZZ domainSEOUL NAT UNIV R&DB FOUNDATION·Filed 2016·Granted Aug 27, 2019·2 cites·2 claims
- 0976US9754892B2Stacked semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2012·Granted Sep 5, 2017·4 cites·17 claims
- 1074US6339260B1Wire arrayed chip size packageHYUNDAI ELECTRONICS IND·Filed 1999·Granted Jan 15, 2002·29 cites·8 claims
- 1172US10964656B2Semiconductor package and method of manufacturing sameNEPES CO LTD·Filed 2019·Granted Mar 30, 2021·2 cites·16 claims
- 1271US9793251B2Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2015·Granted Oct 17, 2017·2 cites·18 claims
- 1369US12509420B2Compound as a UBR box domain ligandAUTOTAC INC·Filed 2021·Granted Dec 30, 2025·0 cites·9 claims
- 1468US12427346B2P62 ligand compound, and composition for preventing, ameliorating or treating proteinopathies comprising the sameAUTOTAC INC·Filed 2019·Granted Sep 30, 2025·0 cites·12 claims
- 1566US12129218B2AUTOTAC chimeric compound, and composition for preventing, ameliorating or treating diseases through targeted protein degradation comprising the sameAUTOTAC INC·Filed 2019·Granted Oct 29, 2024·0 cites·12 claims
- 1665US11981618B2P62 ligand compound, and composition for preventing, ameliorating or treating proteinopathies comprising the sameAUTOTAC INC·Filed 2019·Granted May 14, 2024·0 cites·12 claims
- 1765US6803251B2Integrated device package and fabrication methods thereofHYUNDAI ELECTRONICS IND·Filed 2001·Granted Oct 12, 2004·11 cites·20 claims
- 1860US12383624B2Cargo delivery system and composition comprising the sameSEOUL NAT UNIV R&DB FOUNDATION·Filed 2023·Granted Aug 12, 2025·0 cites·8 claims
- 1960US11753376B2Benzyloxy pyridine derivatives and uses thereofAUTOTAC INC·Filed 2022·Granted Sep 12, 2023·0 cites·8 claims
- 2060US5559372AThin soldered semiconductor packageGOLD STAR ELECTRONICS·Filed 1995·Granted Sep 24, 1996·25 cites·3 claims
- 2159US6114760ABall grid array (BGA) semiconductor package memberLG SEMICON CO LTD·Filed 1998·Granted Sep 5, 2000·26 cites·16 claims
- 2258US2004023311A1Modulation of angiogenesis through targeting of cysteine oxygenase activityFiled 2003·Application pending·0 cites
- 2357US5861312ANucleic acid encoding mammalian UBR1CALIFORNIA INST OF TECHN·Filed 1997·Granted Jan 19, 1999·11 cites·10 claims
- 2455US6159732ANucleic acid encoding mammalian Ubr1CALIFORNIA INST OF TECHN·Filed 1999·Granted Dec 12, 2000·8 cites·8 claims
- 2554US9006872B2Semiconductor chip package having via hole and semiconductor module thereofKWON YONG-TAE·Filed 2011·Granted Apr 14, 2015·1 cites·13 claims
- 2654US2025087617A1Semiconductor packageNEPES CO LTD·Filed 2023·Application pending·0 cites
- 2753US12494421B2Semiconductor package including redistribution structure, and method of manufacturing the sameNEPES CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·9 claims
- 2851US7588901B2Modulation of angiogenesis through targeting of arginyl transferase (ATE1)CALIFORNIA INST OF TECHN·Filed 2006·Granted Sep 15, 2009·0 cites·24 claims
- 2951US2022352059A1Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2022·Application pending·0 cites
- 3050US2025120944A1Antibacterial compositionSEOUL NAT UNIV R&DB FOUNDATION·Filed 2021·Application pending·0 cites
- 3150US2022402873A1Novel p62 ligand compound, and composition containing same for preventing, ameliorating, or treating proteinopathiesAUTOTAC INC·Filed 2020·Application pending·0 cites
- 3248US2022323379A1P62 ligand compound and er-phagy-promoting use thereofDALECO PROTECH PARTNERS LP·Filed 2020·Application pending·0 cites
- 3347US12065394B2Compound and pharmaceutical composition for preventing or treating obesity or metabolic syndrome comprising thereofSEOUL NAT UNIV R&DB FOUNDATION·Filed 2019·Granted Aug 20, 2024·0 cites·9 claims
- 3443US12183704B2Semiconductor package and method for manufacturing the sameNEPES CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·6 claims
- 3543US12125775B2Semiconductor package and method for manufacturing the sameNEPES CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·12 claims
- 3643US2004009538A1Modulation of angiogenesis through targeting of arginyl transferase (ATE1)Filed 2003·Application pending·0 cites
- 3742US12205904B2Wafer-level design and wiring pattern for a semiconductor packageNEPES CO LTD·Filed 2019·Granted Jan 21, 2025·0 cites·10 claims
- 3842US12198997B2Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficientsNEPES CO LTD·Filed 2019·Granted Jan 14, 2025·0 cites·13 claims
- 3940US7575881B2Modulation of nitric oxide signaling through signaling through specific regulation by arginylation and the N-end rule pathwayCALIFORNIA INST OF TECHN·Filed 2005·Granted Aug 18, 2009·0 cites·36 claims
- 4040US2006032456A1Bag for pet animalKWON YONG-TAE·Filed 2003·Application pending·0 cites
- 4140US2020273830A1Semiconductor device and method for manufacturing the sameNEPES CO LTD·Filed 2020·Application pending·0 cites
- 4235US2017069564A1Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2016·Application pending·0 cites
- 4335US2012146216A1Semiconductor package and fabrication method thereofKANG IN SOO·Filed 2011·Application pending·0 cites
- 4434US11450535B2Manufacturing method for semiconductor package including filling member and membrane memberNEPES CO LTD·Filed 2017·Granted Sep 20, 2022·0 cites·4 claims
- 4534US2016293580A1System in package and method for manufacturing the sameNEPES CO LTD·Filed 2015·Application pending·0 cites
- 4632US2012286419A1Semiconductor package with interposer block thereinKWON YONG TAE·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yong Tae Kwon files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →