Inventor · disambiguated record
Yong Kwan Lee
Also filed as: LEE YONG KWAN
23 granted patents·17 pending applications·179 citations·filing 2000–2025
94Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15LEE YONG-KWAN8JUSUNG ENG CO LTD4SAMSUNG ELECTRO MECH3TECH UNIV OF KOREA INDUSTRY ACADEMIC COOPERATION FOUNDATION2
Top patents by PatentIndex Score
40 records- 0189US10756075B2Package-on-package type semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 25, 2020·7 cites·18 claims
- 0288US9642238B2Antenna structure and plasma generating deviceSEMES CO LTD·Filed 2016·Granted May 2, 2017·4 cites·3 claims
- 0387US7088047B2Inductively coupled plasma generator having low aspect ratioPLASMART CO LTD·Filed 2005·Granted Aug 8, 2006·12 cites·4 claims
- 0487US6288493B1Antenna device for generating inductively coupled plasmaJUSUNG ENG CO LTD·Filed 2000·Granted Sep 11, 2001·84 cites·23 claims
- 0586US8241968B2Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor packageLEE YONG-KWAN·Filed 2010·Granted Aug 14, 2012·8 cites·16 claims
- 0682US11450614B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 20, 2022·1 cites·20 claims
- 0782US9041180B2Semiconductor package and method of manufacturing the semiconductor packageLEE YONG-KWAN·Filed 2014·Granted May 26, 2015·6 cites·20 claims
- 0882US8035056B2Plasma generation apparatusJUSUNG ENG CO LTD·Filed 2008·Granted Oct 11, 2011·6 cites·18 claims
- 0981US7442273B2Apparatus using hybrid coupled plasmaJUSUNG ENG CO LTD·Filed 2004·Granted Oct 28, 2008·18 cites·14 claims
- 1079US8304925B2Movable object type high-efficiency wave energy apparatusYANG DONG-SOON·Filed 2009·Granted Nov 6, 2012·17 cites·14 claims
- 1178US11069588B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·16 claims
- 1276US9282624B2Antenna structure and plasma generating deviceLEE YONG KWAN·Filed 2011·Granted Mar 8, 2016·4 cites·6 claims
- 1375US7411148B2Plasma generation apparatusJUSUNG ENG CO LTD·Filed 2006·Granted Aug 12, 2008·8 cites·18 claims
- 1473US2025362339A1Semiconductor test apparatusOKINS ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1568US10607905B2Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting regionSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 31, 2020·1 cites·20 claims
- 1667US11862570B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 1764US10361135B2Semiconductor package including landing pads extending at an oblique angle toward a through-hole in the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 23, 2019·1 cites·20 claims
- 1863US11699626B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 1959US2025269471A1Laser processing monitoring method and deviceTECH UNIV OF KOREA INDUSTRY ACADEMIC COOPERATION FOUNDATION·Filed 2022·Application pending·0 cites
- 2058US2024145268A1Molding apparatus for fabricating semiconductor package and molding method of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2157US11562965B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 2253US11955359B2Magazine supporting equipment and semiconductor manufacturing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·13 claims
- 2353US2014020714A1Non-contact multi-transfer apparatus and method for removing dust by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2453US2011072447A1Disk drive motorLEE YONG KWAN·Filed 2009·Application pending·0 cites
- 2552US12051680B2Semiconductor package aligning interposer and substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 30, 2024·0 cites·18 claims
- 2652US2025156718A1Training device, training method, and device and method of diagnosing anomaly of equipment using signal reconstruction modelTECH UNIV OF KOREA INDUSTRY ACADEMIC COOPERATION FOUNDATION·Filed 2024·Application pending·0 cites
- 2750US8213112B2Motor having a pressure difference generation portion disposed in a space between a disk and rotor case and disk drive apparatus including the motorLEE YONG KWAN·Filed 2009·Granted Jul 3, 2012·0 cites·11 claims
- 2849US9357652B2Method of manufacturing circuit board and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 31, 2016·0 cites·20 claims
- 2948US9747827B2Driving circuit of display device for compensating image data and method for driving the sameLG DISPLAY CO LTD·Filed 2013·Granted Aug 29, 2017·0 cites·19 claims
- 3047US2012307445A1Printed circuit board (pcb) including a wire pattern, semiconductor package including the pcb, electrical and electronic apparatus including the semiconductor package, method of fabricating the pcb, and method of fabricating the semiconductor packageLEE YONG-KWAN·Filed 2012·Application pending·0 cites
- 3146US2009155984A1Backside protection film, method of forming the same and method of manufacturing a semiconductor package using the sameKIM WON-KEUN·Filed 2008·Application pending·0 cites
- 3246US2010013079A1Package substrate, semiconductor package having a package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3345US2015103494A1Printed circuit boards having metal layers and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3442US2014314539A1Non-contact substrate transfer turnerSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3542US2006255471A1Flip chip package having protective cap and method of fabricating the sameLEE YONG-KWAN·Filed 2006·Application pending·0 cites
- 3641US2013148310A1Printed circuit board having wire patternSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 3740US2013024878A1Spindle motorSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 3839US2012168937A1Flip chip package and method of manufacturing the sameLEE YONG-KWAN·Filed 2011·Application pending·0 cites
- 3937US2002007794A1Plasma processing apparatusFiled 2001·Application pending·0 cites
- 4036US2004245653A1Flip chip package having protective cap and method of fabricating the sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →