Inventor · disambiguated record
Yoko Nishino
Also filed as: NISHINO YOKO
22 granted patents·2 pending applications·297 citations·filing 2011–2017
95Inventor score
Top patents by PatentIndex Score
24 records- 0198US9789565B2Wafer producing methodDISCO CORP·Filed 2015·Granted Oct 17, 2017·28 cites·2 claims
- 0298US9620415B2Wafer processing methodDISCO CORP·Filed 2016·Granted Apr 11, 2017·49 cites·4 claims
- 0398US9481051B2Wafer producing methodDISCO CORP·Filed 2016·Granted Nov 1, 2016·48 cites·3 claims
- 0497US9517530B2Wafer producing methodDISCO CORP·Filed 2016·Granted Dec 13, 2016·31 cites·1 claims
- 0596US9925619B2Wafer producing methodDISCO CORP·Filed 2016·Granted Mar 27, 2018·23 cites·3 claims
- 0696US9808884B2Polycrystalline SiC wafer producing methodDISCO CORP·Filed 2016·Granted Nov 7, 2017·16 cites·4 claims
- 0795US10357851B2Wafer producing methodDISCO CORP·Filed 2017·Granted Jul 23, 2019·15 cites·2 claims
- 0895US9764420B2Wafer producing methodDISCO CORP·Filed 2015·Granted Sep 19, 2017·14 cites·2 claims
- 0995US9764428B2Wafer producing methodDISCO CORP·Filed 2015·Granted Sep 19, 2017·15 cites·2 claims
- 1093US9193008B2Laser processing method and laser processing apparatusMORIKAZU HIROSHI·Filed 2012·Granted Nov 24, 2015·14 cites·7 claims
- 1192US9174305B2Laser processing apparatus including plasma detecting meansDISCO CORP·Filed 2012·Granted Nov 3, 2015·14 cites·2 claims
- 1291US9884389B2SiC ingot slicing methodDISCO CORP·Filed 2015·Granted Feb 6, 2018·7 cites·2 claims
- 1390US10081076B2Wafer producing methodDISCO CORP·Filed 2016·Granted Sep 25, 2018·4 cites·3 claims
- 1489US10319593B2Wafer thinning methodDISCO CORP·Filed 2016·Granted Jun 11, 2019·6 cites·4 claims
- 1587US10076804B2Wafer producing methodDISCO CORP·Filed 2016·Granted Sep 18, 2018·3 cites·3 claims
- 1684US9899262B2Wafer processing methodDISCO CORP·Filed 2016·Granted Feb 20, 2018·4 cites·4 claims
- 1783US10625371B2Wafer producing methodDISCO CORP·Filed 2016·Granted Apr 21, 2020·2 cites·2 claims
- 1875US9884390B2Wafer producing methodDISCO CORP·Filed 2015·Granted Feb 6, 2018·2 cites·6 claims
- 1966US10369659B2Wafer producing methodDISCO CORP·Filed 2016·Granted Aug 6, 2019·1 cites·3 claims
- 2065US8759195B2Optical device wafer processing methodMORIKAZU HIROSHI·Filed 2011·Granted Jun 24, 2014·1 cites·4 claims
- 2151US9174306B2Laser processing method for nonlinear crystal substrateMORIKAZU HIROSHI·Filed 2012·Granted Nov 3, 2015·0 cites·14 claims
- 2245US2012298636A1Laser processing apparatusNOMARU KEIJI·Filed 2012·Application pending·0 cites
- 2341US2013017640A1Method of processing optical device waferDISCO CORP·Filed 2012·Application pending·0 cites
- 2437US10297438B2Water producing methodDISCO CORP·Filed 2016·Granted May 21, 2019·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →