Inventor · disambiguated record
Yoshinori Nishitani
Also filed as: NISHITANI YOSHINORI
12 granted patents·2 pending applications·26 citations·filing 2004–2020
87Inventor score
Top patents by PatentIndex Score
14 records- 0178US11584824B2Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor deviceENEOS CORP·Filed 2018·Granted Feb 21, 2023·3 cites·21 claims
- 0278US11578166B2Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor deviceENEOS CORP·Filed 2018·Granted Feb 14, 2023·3 cites·20 claims
- 0377US12258472B2Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor deviceENEOS CORP·Filed 2020·Granted Mar 25, 2025·1 cites·20 claims
- 0471US8697803B2Epoxy resin composition and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2012·Granted Apr 15, 2014·2 cites·7 claims
- 0568US12441833B2Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor deviceENEOS CORP·Filed 2019·Granted Oct 14, 2025·1 cites·20 claims
- 0665US11897998B2Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor deviceENEOS CORP·Filed 2018·Granted Feb 13, 2024·1 cites·20 claims
- 0764US8008410B2Epoxy resin composition for encapsulating semiconductor and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2007·Granted Aug 30, 2011·4 cites·14 claims
- 0860US8324326B2Epoxy resin composition and semiconductor deviceKOTANI TAKAHIRO·Filed 2008·Granted Dec 4, 2012·2 cites·7 claims
- 0959US7354978B2Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compoundSUMITOMO BAKELITE CO·Filed 2004·Granted Apr 8, 2008·9 cites·2 claims
- 1055US11555092B2Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor deviceENEOS CORP·Filed 2019·Granted Jan 17, 2023·0 cites·21 claims
- 1153US8921461B2Epoxy resin composition and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2012·Granted Dec 30, 2014·0 cites·10 claims
- 1249US11560465B2Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor deviceENEOS CORP·Filed 2018·Granted Jan 24, 2023·0 cites·13 claims
- 1346US2020095422A1Curable resin composition, cured product obtained from the same, method for hardening the same, and semiconductor deviceJXTG NIPPON OIL & ENERGY CORP·Filed 2017·Application pending·0 cites
- 1442US2006157872A1Epoxy resin composition and semiconductor deviceKOTANI TAKAHIRO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →