Inventor · disambiguated record
Yoichi Shiokawa
Also filed as: SHIOKAWA YOICHI
20 granted patents·18 pending applications·81 citations·filing 1976–2024
93Inventor score
Top patents by PatentIndex Score
38 records- 0198US11450544B2Substrate processing apparatus, substrate processing system, and substrate processing methodEBARA CORP·Filed 2020·Granted Sep 20, 2022·8 cites·10 claims
- 0296US10665487B2Substrate processing apparatus, substrate processing system, and substrate processing methodEBARA CORP·Filed 2015·Granted May 26, 2020·8 cites·34 claims
- 0394US8845391B2Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatusSONE TADAKAZU·Filed 2010·Granted Sep 30, 2014·26 cites·21 claims
- 0487US8965555B2Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatusEBARA CORP·Filed 2014·Granted Feb 24, 2015·5 cites·4 claims
- 0584US10399203B2Polishing method and polishing apparatusEBARA CORP·Filed 2015·Granted Sep 3, 2019·4 cites·15 claims
- 0684US8360817B2Polishing apparatus and polishing methodEBARA CORP·Filed 2010·Granted Jan 29, 2013·7 cites·12 claims
- 0783US8655478B2Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatusFUKUDA AKIRA·Filed 2009·Granted Feb 18, 2014·8 cites·12 claims
- 0879US2021229235A1Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatusEBARA CORP·Filed 2021·Application pending·0 cites
- 0978US12062563B2Substrate processing apparatus, substrate processing system, and substrate processing methodEBARA CORP·Filed 2022·Granted Aug 13, 2024·0 cites·22 claims
- 1077US10056277B2Polishing methodEBARA CORP·Filed 2016·Granted Aug 21, 2018·2 cites·10 claims
- 1177US9999955B2Polishing apparatus and polished-state monitoring methodEBARA CORP·Filed 2014·Granted Jun 19, 2018·4 cites·13 claims
- 1274US9550269B2Polishing device and polishing methodEBARA CORP·Filed 2015·Granted Jan 24, 2017·2 cites·18 claims
- 1373US2024391054A1Polishing apparatus and polishing methodEBARA CORP·Filed 2024·Application pending·0 cites
- 1472US2024278378A1Polishing apparatusEBARA CORP·Filed 2023·Application pending·0 cites
- 1571US2019168354A1Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatusEBARA CORP·Filed 2019·Application pending·0 cites
- 1668US2024217062A1Substrate polishing apparatus, substrate processing apparatus, method, and storage mediumEBARA CORP·Filed 2023·Application pending·0 cites
- 1768US2024217060A1Substrate polishing device, substrate processing apparatus, method, and storage mediumEBARA CORP·Filed 2023·Application pending·0 cites
- 1867US2023381919A1Polishing method and polishing apparatusEBARA CORP·Filed 2023·Application pending·0 cites
- 1965US12496677B2Polishing apparatus and polishing methodEBARA CORP·Filed 2022·Granted Dec 16, 2025·0 cites·16 claims
- 2063US2025073847A1Film thickness signal processing apparatus, polishing apparatus, and film thickness signal processing methodEBARA CORP·Filed 2024·Application pending·0 cites
- 2161US11495475B2Method of cleaning a substrateEBARA CORP·Filed 2020·Granted Nov 8, 2022·0 cites·7 claims
- 2261US2014364040A1Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatusEBARA CORP·Filed 2014·Application pending·0 cites
- 2361US2024353344A1Film thickness measurement device, film thickness measurement method and substrate polishing deviceEBARA CORP·Filed 2024·Application pending·0 cites
- 2459US12504273B2Measuring film-thickness of a workpiece in a semiconductor processing apparatus using a composite spectrumEBARA CORP·Filed 2022·Granted Dec 23, 2025·0 cites·14 claims
- 2559US11759913B2Polishing method and polishing apparatusEBARA CORP·Filed 2020·Granted Sep 19, 2023·0 cites·2 claims
- 2659US2025041987A1Polishing apparatusEBARA CORP·Filed 2024·Application pending·0 cites
- 2758US2024359290A1Polishing method, computer-readable storage medium storing program for operating computer, and polishing apparatusEBARA CORP·Filed 2024·Application pending·0 cites
- 2856US11951588B2Optical film-thickness measuring apparatus and polishing apparatusEBARA CORP·Filed 2021·Granted Apr 9, 2024·0 cites·11 claims
- 2956US2021402550A1Polishing method, polishing apparatus, and computer-readable storage medium storing programEBARA CORP·Filed 2021·Application pending·0 cites
- 3052US11833636B2Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrateEBARA CORP·Filed 2020·Granted Dec 5, 2023·0 cites·19 claims
- 3151US2022176513A1Polishing method, polishing monitoring method and polishing monitoring apparatus for workpieceEBARA CORP·Filed 2021·Application pending·0 cites
- 3250US2014190633A1Substrate cleaning apparatus and polishing apparatusEBARA CORP·Filed 2013·Application pending·0 cites
- 3346US2024181594A1Polishing method, and polishing apparatusEBARA CORP·Filed 2022·Application pending·0 cites
- 3443US11911867B2Polishing apparatus and polishing methodEBARA CORP·Filed 2018·Granted Feb 27, 2024·0 cites·3 claims
- 3539US10556314B2Head height adjustment device and substrate processing apparatus provided with head height adjustment deviceEBARA CORP·Filed 2017·Granted Feb 11, 2020·0 cites·15 claims
- 3636US2018211849A1Substrate processing apparatus, substrate processing system and substrate processing methodEBARA CORP·Filed 2016·Application pending·0 cites
- 3736US2017352573A1Substrate processing apparatusEBARA CORP·Filed 2017·Application pending·0 cites
- 3833US4059902ATray for preparing a dentiform model used for an operation on a dental technicSHIOKAWA YOICHI·Filed 1976·Granted Nov 29, 1977·7 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →