Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus

Abstract

An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

1 - 24 . (canceled) 
     
     
         25 . A pad-temperature regulating apparatus for regulating a temperature of a polishing surface of a polishing pad for use in a substrate polishing apparatus, said pad-temperature regulating apparatus comprising:
 a solid member having a fluid passage formed therein and having a contact surface which is brought into contact with the polishing surface of the polishing pad; and   a support structure configured to support said solid member while allowing said solid member to pivot in a radial direction and a circumferential direction of the polishing pad.   
     
     
         26 . The pad-temperature regulating apparatus according to  claim 25 , wherein said contact surface is made of SiC or alumina. 
     
     
         27 . The pad-temperature regulating apparatus according to  claim 25 , wherein said solid member is placed in contact with the polishing surface by its own weight. 
     
     
         28 . The pad-temperature regulating apparatus according to  claim 25 , further comprising:
 a raising mechanism capable of raising up said solid member to an upright position at a periphery of said polishing pad so that said solid member does not hinder replacement of the polishing pad.