Inventor · disambiguated record
Yong Seon Song
Also filed as: SONG YONG · SONG YONG SEON
17 granted patents·4 pending applications·39 citations·filing 2008–2024
90Inventor score
Files withAMKOR TECHNOLOGY INC5SONG YONG SEON4AMKOR TECH SINGAPORE HOLDING PTE LTD3KIM GEUN-HO2LG INNOTEK CO LTD2
Top patents by PatentIndex Score
21 records- 0194US10079157B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 18, 2018·9 cites·20 claims
- 0292US8426844B2Light emitting device, light emitting device package, and display device therewithMOON YONG TAE·Filed 2011·Granted Apr 23, 2013·11 cites·20 claims
- 0383US2024266189A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0482US11101144B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 24, 2021·2 cites·21 claims
- 0578US8299477B2Light emitting device and method for fabricating the sameKIM GEUN HO·Filed 2008·Granted Oct 30, 2012·7 cites·6 claims
- 0677US11233176B2Semiconductor device and semiconductor device packageSUZHOU LEKIN SEMICONDUCTOR CO LTD·Filed 2018·Granted Jan 25, 2022·1 cites·19 claims
- 0774US11961742B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 16, 2024·0 cites·18 claims
- 0873US8384117B2Light emitting device package and lighting system including the sameLG INNOTEK CO LTD·Filed 2010·Granted Feb 26, 2013·4 cites·11 claims
- 0968US9893118B2Light emitting device and method for fabricating the sameLG INNOTEK CO LTD·Filed 2012·Granted Feb 13, 2018·2 cites·20 claims
- 1062US8217416B2Light emitting device package and method for fabricating the sameKIM GEUN HO·Filed 2008·Granted Jul 10, 2012·2 cites·6 claims
- 1159US10515825B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 1259US9711484B2Semiconductor package with semiconductor die directly attached to lead frame and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Jul 18, 2017·1 cites·14 claims
- 1350US9048241B2Semiconductor device utilzing redistribution layers to couple stacked diePAEK JONG SIK·Filed 2013·Granted Jun 2, 2015·0 cites·20 claims
- 1447US9190370B2Semiconductor device utilizing redistribution layers to couple stacked dieAMKOR TECHNOLOGY INC·Filed 2015·Granted Nov 17, 2015·0 cites·20 claims
- 1547US8269249B2Light emitting device packageSONG YONG SEON·Filed 2009·Granted Sep 18, 2012·0 cites·21 claims
- 1646US8669545B2Light emitting device having sub barrier layers with varying energy bands, light emitting device package and lighting system including the light emitting device packageSONG YONG SEON·Filed 2012·Granted Mar 11, 2014·0 cites·21 claims
- 1744US2012119254A1Light emitting device, light emitting device package and lighting system including the sameMOON YONG TAE·Filed 2012·Application pending·0 cites
- 1841US2014124810A1Light emitting device and light emitting device package having the sameKIM SANG IL·Filed 2013·Application pending·0 cites
- 1938US9035325B2Light emitting device package and lighting systemSONG YONG SEON·Filed 2010·Granted May 19, 2015·0 cites·18 claims
- 2037US8587016B2Light emitting device package having light emitting device on inclined side surface and lighting system including the sameSONG YONG SEON·Filed 2010·Granted Nov 19, 2013·0 cites·20 claims
- 2133US2016379915A1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →