Inventor · disambiguated record
Yoshiharu Takada
Also filed as: TAKADA YOSHIHARU
25 granted patents·8 pending applications·259 citations·filing 1988–2024
95Inventor score
Files withTOSHIBA KK21TAKADA YOSHIHARU4NIPPON LEAKLESS IND CO LTD3YAMAZAKI MAZAK CORP3ABE TSUNEHIKO1
Top patents by PatentIndex Score
33 records- 0195US5006685AMachine tool with grinding function and truing/dressing method of grinding stone using itYAMAZAKI MAZAK CORP·Filed 1988·Granted Apr 9, 1991·46 cites·17 claims
- 0287US8525274B2Semiconductor device and method of manufacturing the sameTAKADA YOSHIHARU·Filed 2011·Granted Sep 3, 2013·10 cites·10 claims
- 0386US5240284ASteering column assembly with horizontal position adjustment mechanismFUJI KIKO KK·Filed 1991·Granted Aug 31, 1993·58 cites·16 claims
- 0483US8816388B2Semiconductor device with gate protection diodeTAKADA YOSHIHARU·Filed 2012·Granted Aug 26, 2014·7 cites·9 claims
- 0581US9419119B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2015·Granted Aug 16, 2016·3 cites·20 claims
- 0680US8723234B2Semiconductor device having a diode forming area formed between a field-effect transistor forming area and a source electrode bus wiring or padTAKADA YOSHIHARU·Filed 2011·Granted May 13, 2014·6 cites·13 claims
- 0780US5078256AMachine tool having a chip collecting apparatusYAMAZAKI MAZAK CORP·Filed 1990·Granted Jan 7, 1992·40 cites·3 claims
- 0875US10074736B2Semiconductor deviceTOSHIBA KK·Filed 2015·Granted Sep 11, 2018·2 cites·10 claims
- 0975US9171807B2Semiconductor device in which internal stress in a layer is relaxed to suppress warpingTOSHIBA KK·Filed 2013·Granted Oct 27, 2015·3 cites·7 claims
- 1074US8963203B2Nitride semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2013·Granted Feb 24, 2015·3 cites·12 claims
- 1173US5045664AMachine tool with grinding function and truing/dressing method of grinding stone using itYAMAZAKI MAZAK CORP·Filed 1990·Granted Sep 3, 1991·36 cites·16 claims
- 1268US10784165B2Semiconductor device and dicing methodTOSHIBA KK·Filed 2018·Granted Sep 22, 2020·1 cites·7 claims
- 1367US11688711B2Semiconductor device having second connector that overlaps a part of first connectorTOSHIBA KK·Filed 2021·Granted Jun 27, 2023·0 cites·13 claims
- 1466US8969917B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2013·Granted Mar 3, 2015·2 cites·5 claims
- 1566US5110630AMetal gasket and method of producing the sameNIPPON LEAKLESS IND CO LTD·Filed 1991·Granted May 5, 1992·25 cites·7 claims
- 1663US5130203AMetal gasket and method of producing the sameNIPPON LEAKLESS IND CO LTD·Filed 1989·Granted Jul 14, 1992·14 cites·4 claims
- 1763US2025118699A1Semiconductor deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1861US8169035B2Semiconductor deviceTAKADA YOSHIHARU·Filed 2009·Granted May 1, 2012·2 cites·13 claims
- 1960US11195814B2Semiconductor device having second connector that overlaps a part of first connectorTOSHIBA KK·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 2058US7989027B2Metal gasket material plate and method for manufacturing the sameNIPPON LEAKLESS IND CO LTD·Filed 2007·Granted Aug 2, 2011·1 cites·6 claims
- 2156US12315823B2Semiconductor deviceTOSHIBA KK·Filed 2022·Granted May 27, 2025·0 cites·18 claims
- 2252US11456201B2Semiconductor substrate and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2021·Granted Sep 27, 2022·0 cites·6 claims
- 2350US2022310539A1Semiconductor deviceTOSHIBA KK·Filed 2021·Application pending·0 cites
- 2447US9287368B2Nitride semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2015·Granted Mar 15, 2016·0 cites·9 claims
- 2546US10998437B2Semiconductor deviceTOSHIBA KK·Filed 2019·Granted May 4, 2021·0 cites·18 claims
- 2645US9953894B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2017·Granted Apr 24, 2018·0 cites·6 claims
- 2745US2011254235A1Metal gasket material plate and method for manufacturing the sameABE TSUNEHIKO·Filed 2011·Application pending·0 cites
- 2841US10825756B2Chip attached to a die pad having a concave structureTOSHIBA KK·Filed 2019·Granted Nov 3, 2020·0 cites·8 claims
- 2933US2016211225A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3033US2016268408A1Semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3133US2016268410A1Semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3233US2016218067A1Semiconductor device and method of manufacturing the semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3332US2016079120A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →