Inventor · disambiguated record
Yoshihiro Tomura
Also filed as: TOMURA YOSHIHIRO
33 granted patents·3 pending applications·785 citations·filing 1977–2012
97Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD10PANASONIC CORP8TOMURA YOSHIHIRO4IWASE TEPPEI3NIPPON OILS & FATS CO LTD2
Top patents by PatentIndex Score
36 records- 0193US5485949ACapillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillaryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jan 23, 1996·159 cites·19 claims
- 0292US6088236ASemiconductor device having a bump having a rugged sideMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 11, 2000·125 cites·14 claims
- 0390US5545589AMethod of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Aug 13, 1996·101 cites·13 claims
- 0487US7762819B2Substrate connecting member and connecting structurePANASONIC CORP·Filed 2006·Granted Jul 27, 2010·14 cites·11 claims
- 0585US7845954B2Interconnecting board and three-dimensional wiring structure using itPANASONIC CORP·Filed 2006·Granted Dec 7, 2010·13 cites·8 claims
- 0685US5640051AChip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complexMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jun 17, 1997·74 cites·31 claims
- 0781US5670826AMethod for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Sep 23, 1997·55 cites·7 claims
- 0876US4148591AWriting unit locking mechanism in a multiple-point writing implement including a mechanical pencil unitPILOT PEN CO LTD·Filed 1977·Granted Apr 10, 1979·26 cites·8 claims
- 0975US5940679AMethod of checking electric circuits of semiconductor device and conductive adhesive for checking usageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Aug 17, 1999·49 cites·9 claims
- 1074US8207618B2Semiconductor device and method of manufacturing the sameSHIMIZU KAZUMICHI·Filed 2010·Granted Jun 26, 2012·5 cites·9 claims
- 1174US5628919AMethods for producing a chip carrier and terminal electrode for a circuit substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted May 13, 1997·40 cites·12 claims
- 1273US8110933B2Semiconductor device mounted structure and semiconductor device mounted methodTOMURA YOSHIHIRO·Filed 2007·Granted Feb 7, 2012·6 cites·7 claims
- 1372US8283570B2Semiconductor assembly and multilayer wiring boardTOMURA YOSHIHIRO·Filed 2008·Granted Oct 9, 2012·5 cites·12 claims
- 1472US8033016B2Method for manufacturing an electrode and electrode component mounted bodyPANASONIC CORP·Filed 2006·Granted Oct 11, 2011·6 cites·10 claims
- 1571US5651179AMethod for mounting a semiconductor device on a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 29, 1997·34 cites·10 claims
- 1670US8080884B2Mounting structure and mounting methodNAKAMURA KOJIRO·Filed 2009·Granted Dec 20, 2011·7 cites·8 claims
- 1768US8895359B2Semiconductor device, flip-chip mounting method and flip-chip mounting apparatusTOMURA YOSHIHIRO·Filed 2009·Granted Nov 25, 2014·4 cites·2 claims
- 1867US8106521B2Semiconductor device mounted structure with an underfill sealing-bonding resin with voidsIWASE TEPPEI·Filed 2007·Granted Jan 31, 2012·4 cites·9 claims
- 1966US8426965B2Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing toolIWASE TEPPEI·Filed 2012·Granted Apr 23, 2013·2 cites·6 claims
- 2066US8163599B2Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatusTOMURA YOSHIHIRO·Filed 2009·Granted Apr 24, 2012·4 cites·5 claims
- 2165US8264079B2Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing toolIWASE TEPPEI·Filed 2008·Granted Sep 11, 2012·3 cites·7 claims
- 2264US4202641AMultiple-point writing instrument including a mechanical pencil unitPILOT PEN CO LTD·Filed 1977·Granted May 13, 1980·17 cites·4 claims
- 2360US8154123B2Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structureKONDOU SHIGERU·Filed 2010·Granted Apr 10, 2012·2 cites·13 claims
- 2460US7985078B2Electrode junction structure and manufacturing method thereofPANASONIC CORP·Filed 2009·Granted Jul 26, 2011·1 cites·15 claims
- 2554US2007079957A1Heat exchangerDENSO CORP·Filed 2006·Application pending·0 cites
- 2653US6613180B2Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting bodyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Sep 2, 2003·5 cites·16 claims
- 2751US8050049B2Semiconductor devicePANASONIC CORP·Filed 2009·Granted Nov 1, 2011·0 cites·4 claims
- 2850US8436253B2Method of manufacturing mounting structure and mounting structureHIGUCHI TAKAYUKI·Filed 2009·Granted May 7, 2013·0 cites·7 claims
- 2948US8358018B2Resin sealing structure for electronic component and resin sealing method for electronic componentPANASONIC CORP·Filed 2009·Granted Jan 22, 2013·0 cites·2 claims
- 3047US7994638B2Semiconductor chip and semiconductor devicePANASONIC CORP·Filed 2008·Granted Aug 9, 2011·0 cites·9 claims
- 3146US5004364ADevice for advancing and retracting writing element in writing instrumentPILOT KK·Filed 1990·Granted Apr 2, 1991·15 cites·4 claims
- 3244US5254602ACurability-imparting composition, method for curing with said composition, and method for production of glass fiber-reinforced plasticNIPPON OILS & FATS CO LTD·Filed 1992·Granted Oct 19, 1993·6 cites·12 claims
- 3339US8415794B2Semiconductor device having stable signal transmission at high speed and high frequencyKUMAZAWA KENTARO·Filed 2009·Granted Apr 9, 2013·0 cites·8 claims
- 3437US2004140571A1Mounting structure of electronic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 3537US2010276803A1Semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2010·Application pending·0 cites
- 3636US5017626AVisible light-curing polyester resin compositionNIPPON OILS & FATS CO LTD·Filed 1988·Granted May 21, 1991·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →