Inventor · disambiguated record
Yoshihiro Tsutsumi
Also filed as: TSUTSUMI YOSHIHIRO
24 granted patents·38 pending applications·20 citations·filing 1992–2025
91Inventor score
Files withSHINETSU CHEMICAL CO53TOKYO ELECTRON LTD5DAIKIN IND LTD2DISCO CORP1MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1
Top patents by PatentIndex Score
62 records- 0188US8933158B2Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2013·Granted Jan 13, 2015·11 cites·11 claims
- 0286US2025059312A1Heat-curable maleimide resin compositionSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0382US12012485B2Heat-curable citraconimide resin compositionSHINETSU CHEMICAL CO·Filed 2022·Granted Jun 18, 2024·1 cites·14 claims
- 0478US9209085B2Wafer processing methodDISCO CORP·Filed 2014·Granted Dec 8, 2015·4 cites·3 claims
- 0577US12162971B2Heat-curable maleimide resin compositionSHINETSU CHEMICAL CO·Filed 2021·Granted Dec 10, 2024·0 cites·15 claims
- 0677US2022267526A1Maleimide resin film and composition for maleimide resin filmSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0775US10793712B2Heat-curable resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Oct 6, 2020·2 cites·6 claims
- 0872US10865304B2Heat-curable resin composition, heat-curable resin film and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 15, 2020·0 cites·10 claims
- 0971US12264270B2Method for producing cured product of heat-curable maleimide resin compositionSHINETSU CHEMICAL CO·Filed 2023·Granted Apr 1, 2025·0 cites·8 claims
- 1071US2025084205A1Resin compositionSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1171US2024084075A1Heat-curable bismaleimide resin compositionSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1271US2023399548A1Bonding film for high-speed communication boardSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1369US2024182646A1Bismaleimide compound, resin varnish, and production method thereofSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1469US2021061955A1Maleimide resin film and composition for maleimide resin filmSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1566US2023130867A1Cyclic imide resin composition, liquid adhesive, film, prepreg, copper-clad laminate and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1665US2025140438A1Insulating coating material for coating electric wire, insulated wire, coil, and electric or electronic deviceSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1764US2023140237A1Heat-curable maleimide resin composition, film, prepreg, laminate and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1864US2023143093A1Heat-curable maleimide resin compositionSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1963US12421435B2Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing sameSHINETSU CHEMICAL CO·Filed 2022·Granted Sep 23, 2025·0 cites·14 claims
- 2062US2025084216A1Curable maleimide resin composition, adhesive, primer, chip coating agent, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 2162US2023040536A1Photocurable maleimide resin compositionSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 2261US9463997B2Composite particle, method of producing same, resin composition containing the particle, reflector formed from the composition, and light-emitting semiconductor device using the reflectorSHINETSU CHEMICAL CO·Filed 2014·Granted Oct 11, 2016·1 cites·23 claims
- 2361US8877849B2Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2013·Granted Nov 4, 2014·1 cites·18 claims
- 2461US2021371594A1Heat-curable maleimide resin composition and adhesive agent, substrate material, primer, coating material and semiconductor device using sameSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 2560US11639410B2Heat-curable resin composition and uses thereofSHINETSU CHEMICAL CO·Filed 2020·Granted May 2, 2023·0 cites·29 claims
- 2660US2024247128A1Curable maleimide resin composition, adhesive, primer, chip coating agent, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 2759US2025054904A1Release Layer for IR Laser Lift-Off ProcessTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2859US2025012517A1Method for manufacturing finDAIKIN IND LTD·Filed 2024·Application pending·0 cites
- 2959US2025296294A1Copper foil with resin, and copper-clad laminate and printed wiring board using the sameSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 3057US11773100B2Bismaleimide compound and production method thereofSHINETSU CHEMICAL CO·Filed 2021·Granted Oct 3, 2023·0 cites·10 claims
- 3157US2024191029A1Heat-curable imide resin composition, and uncured resin film, cured resin film, prepreg, substrate, adhesive and semiconductor encapsulation material using sameSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 3257US2025079166A1Methods for protecting to reuse silicon carrier wafer based on ir laser lift-off processTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3356US11608438B2Low-dielectric heat dissipation film composition and low-dielectric heat dissipation filmSHINETSU CHEMICAL CO·Filed 2020·Granted Mar 21, 2023·0 cites·10 claims
- 3456US10600707B2Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipmentSHINETSU CHEMICAL CO·Filed 2018·Granted Mar 24, 2020·0 cites·20 claims
- 3556US2021079219A1Maleimide resin composition and maleimide resin filmSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 3655US11530324B2Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured productSHINETSU CHEMICAL CO·Filed 2020·Granted Dec 20, 2022·0 cites·7 claims
- 3755US2024117120A1Curable resin composition for bonding film, bonding film, and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 3855US2021017337A1Aromatic bismaleimide compound, production method thereof, and heat-curable cyclic imide resin composition containing the compoundSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 3954US2019355638A1Heat-curable maleimide resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 4054US2025207869A1Heat exchangerDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 4154US2019338094A1Quartz glass fiber-containing prepreg and quartz glass fiber-containing substrateSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 4254US2021054152A1Heat-curable resin composition, and adhesive agent, film, prepreg, laminate, circuit board and printed-wiring board using sameSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 4353US2024250064A1Substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4453US2023416466A1Curable resin composition, semiconductor encapsulation material, adhesive, adhesive film, prepreg, interlayer insulating material, and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 4552US10808102B2Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the sameSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 20, 2020·0 cites·5 claims
- 4651US2024079403A1Method for manufacturing substrate with chips, and substrate processing deviceTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4751US2019225762A1Quartz glass fiber-containing prepreg, quartz glass fiber-containing film and quartz glass fiber-containing substrateSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 4850US2024413146A1Method of manufacturing semiconductor device and semiconductor deviceTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4948US10388837B2White heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using sameSHINETSU CHEMICAL CO·Filed 2017·Granted Aug 20, 2019·0 cites·7 claims
- 5047US9884960B2White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the caseSHINETSU CHEMICAL CO·Filed 2016·Granted Feb 6, 2018·0 cites·6 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →