Inventor · disambiguated record
Yong Lam Wai
Also filed as: WAI YONG LAM
5 granted patents·1 pending application·163 citations·filing 2009–2013
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0192US8071470B2Wafer level package using stud bump coated with solderKHOR LILY·Filed 2009·Granted Dec 6, 2011·135 cites·18 claims
- 0286US8674488B2Light emitting diode (LED) packagesCARSEM M SDN BHD·Filed 2013·Granted Mar 18, 2014·9 cites·19 claims
- 0386US8314479B2Leadframe package with recessed cavity for LEDWAI YONG LAM·Filed 2011·Granted Nov 20, 2012·10 cites·19 claims
- 0483US8394675B2Manufacturing light emitting diode (LED) packagesWAI YONG LAM·Filed 2011·Granted Mar 12, 2013·8 cites·14 claims
- 0556US8535988B2Large panel leadframeWAI YONG LAM·Filed 2012·Granted Sep 17, 2013·1 cites·20 claims
- 0641US2012043655A1Wafer-level package using stud bump coated with solderKHOR LILY·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →