Inventor · disambiguated record
Yong Wu
Also filed as: WU YONG · WU YONG-FU
22 granted patents·1 pending application·71 citations·filing 2003–2023
93Inventor score
Top patents by PatentIndex Score
23 records- 0197US10636669B2Seam healing using high pressure annealAPPLIED MATERIALS INC·Filed 2019·Granted Apr 28, 2020·15 cites·20 claims
- 0291US10636659B2Selective deposition for simplified process flow of pillar formationAPPLIED MATERIALS INC·Filed 2018·Granted Apr 28, 2020·7 cites·9 claims
- 0387US10468263B2Tungsten deposition without barrier layerAPPLIED MATERIALS INC·Filed 2018·Granted Nov 5, 2019·4 cites·10 claims
- 0484US7264885B2Enhancement of the wetting of hydrophobic surfaces by aqueous surfactant solutionsUNIV CITY·Filed 2003·Granted Sep 4, 2007·32 cites·10 claims
- 0583US10916505B2Graphene diffusion barrierAPPLIED MATERIALS INC·Filed 2019·Granted Feb 9, 2021·2 cites·18 claims
- 0681US10480066B2Metal deposition methodsAPPLIED MATERIALS INC·Filed 2018·Granted Nov 19, 2019·2 cites·16 claims
- 0779US10930493B2Linerless continuous amorphous metal filmsAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·2 cites·19 claims
- 0879US10854511B2Methods of lowering wordline resistanceAPPLIED MATERIALS INC·Filed 2018·Granted Dec 1, 2020·2 cites·14 claims
- 0977US10559497B2Seamless tungsten fill by tungsten oxidation-reductionAPPLIED MATERIALS INC·Filed 2018·Granted Feb 11, 2020·2 cites·15 claims
- 1077US7736483B2Method for electroplating metal wireIND TECH RES INST·Filed 2007·Granted Jun 15, 2010·2 cites·8 claims
- 1172US12328872B2Liner for V-NAND word line stackAPPLIED MATERIALS INC·Filed 2022·Granted Jun 10, 2025·0 cites·7 claims
- 1272US11289374B2Nucleation-free gap fill ALD processAPPLIED MATERIALS INC·Filed 2017·Granted Mar 29, 2022·1 cites·4 claims
- 1369US12463093B2Method of tuning film properties of metal nitride using plasmaAPPLIED MATERIALS INC·Filed 2023·Granted Nov 4, 2025·0 cites·7 claims
- 1469US12394670B2Nucleation-free gap fill ALD processAPPLIED MATERIALS INC·Filed 2022·Granted Aug 19, 2025·0 cites·16 claims
- 1568US11621226B2Graphene diffusion barrierAPPLIED MATERIALS INC·Filed 2021·Granted Apr 4, 2023·0 cites·18 claims
- 1664US11066743B2Selective atomic layer deposition of rutheniumAPPLIED MATERIALS INC·Filed 2018·Granted Jul 20, 2021·0 cites·18 claims
- 1763US10851454B2Metal deposition methodsAPPLIED MATERIALS INC·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 1862US11476267B2Liner for V-NAND word line stackAPPLIED MATERIALS INC·Filed 2020·Granted Oct 18, 2022·0 cites·8 claims
- 1962US10854461B2Tungsten deposition without barrier layerAPPLIED MATERIALS INC·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 2057US11646226B2Method of tuning film properties of metal nitride using plasmaAPPLIED MATERIALS INC·Filed 2020·Granted May 9, 2023·0 cites·15 claims
- 2154US11244824B2Conformal doped amorphous silicon as nucleation layer for metal depositionAPPLIED MATERIALS INC·Filed 2018·Granted Feb 8, 2022·0 cites·18 claims
- 2252US10991586B2In-situ tungsten deposition without barrier layerAPPLIED MATERIALS INC·Filed 2020·Granted Apr 27, 2021·0 cites·20 claims
- 2345US2004129572A1Method for electroplating metal wireIND TECH RES INST·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →