Inventor · disambiguated record
Yoshiki Yamamoto
Also filed as: YAMAMOTO YOSHIKI
59 granted patents·22 pending applications·143 citations·filing 1995–2024
98Inventor score
Files withRENESAS ELECTRONICS CORP54HITACHI CABLE5YAMAMOTO YOSHIKI5MUROGA TAKEMI4MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2
Top patents by PatentIndex Score
81 records- 0194US9196705B2Method of manufacturing a misfet on an SOI substrateRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 24, 2015·10 cites·7 claims
- 0294US8941178B2MOS field-effect transistor formed on the SOI substrateRENESAS ELECTRONICS CORP·Filed 2013·Granted Jan 27, 2015·9 cites·3 claims
- 0393US9484433B2Method of manufacturing a MISFET on an SOI substrateRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 1, 2016·5 cites·9 claims
- 0491US12261205B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Granted Mar 25, 2025·0 cites·15 claims
- 0590US9887211B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Feb 6, 2018·8 cites·10 claims
- 0689US8221897B2Rolled copper foilMUROGA TAKEMI·Filed 2008·Granted Jul 17, 2012·9 cites·10 claims
- 0788US9935125B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 3, 2018·6 cites·10 claims
- 0888US2024395823A1Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0987US9837424B2Semiconductor device with anti-fuse memory elementRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 5, 2017·5 cites·17 claims
- 1086US11996448B2Manufacturing method of semiconductor device including field-effect transistor comprising buried oxide (BOX) film and silicon layerRENESAS ELECTRONICS CORP·Filed 2023·Granted May 28, 2024·0 cites·15 claims
- 1185US9130039B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 8, 2015·5 cites·2 claims
- 1283US12080716B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Granted Sep 3, 2024·0 cites·12 claims
- 1383US9754661B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 5, 2017·3 cites·18 claims
- 1482US10461158B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Oct 29, 2019·1 cites·10 claims
- 1581US10043881B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 7, 2018·3 cites·14 claims
- 1680US9202761B2Semiconductor integrated circuit device and manufacturing method for semiconductor integrated circuit deviceMAKIYAMA HIDEKI·Filed 2012·Granted Dec 1, 2015·6 cites·7 claims
- 1779US9354780B2Gesture-based selection and movement of objectsPANASONIC CORP·Filed 2012·Granted May 31, 2016·5 cites·19 claims
- 1878US11658211B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2021·Granted May 23, 2023·0 cites·21 claims
- 1978US9343527B2Semiconductor device including an isolation film buried in a grooveRENESAS ELECTRONICS CORP·Filed 2012·Granted May 17, 2016·3 cites·7 claims
- 2078US9024386B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2012·Granted May 5, 2015·3 cites·17 claims
- 2175US9349439B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted May 24, 2016·2 cites·11 claims
- 2274US9299720B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 29, 2016·2 cites·3 claims
- 2373US11695012B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Jul 4, 2023·0 cites·31 claims
- 2473US10002885B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jun 19, 2018·1 cites·18 claims
- 2572US10263012B2Semiconductor integrated circuit device comprising MISFETs in SOI and bulk substrate regionsRENESAS ELECTRONICS CORP·Filed 2018·Granted Apr 16, 2019·1 cites·7 claims
- 2672US7789977B2Rolled copper foil and manufacturing method thereofHITACHI CABLE·Filed 2007·Granted Sep 7, 2010·4 cites·10 claims
- 2771US10411121B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Sep 10, 2019·1 cites·14 claims
- 2871US9953987B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Apr 24, 2018·1 cites·20 claims
- 2971US2020013857A1Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 3068US10529630B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jan 7, 2020·1 cites·19 claims
- 3168US9484271B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 1, 2016·1 cites·6 claims
- 3268US5655050AApparatus and method for recording and reproducing digital signal in synchronization blocksMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 5, 1997·21 cites·10 claims
- 3368US2025194096A1Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3467US10756115B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Aug 25, 2020·0 cites·19 claims
- 3567US10263078B2Method of manufacturing a MISFET on an SOI substrateRENESAS ELECTRONICS CORP·Filed 2018·Granted Apr 16, 2019·0 cites·10 claims
- 3665US9978839B2Method of manufacturing a MOSFET on an SOI substrateRENESAS ELECTRONICS CORP·Filed 2017·Granted May 22, 2018·0 cites·7 claims
- 3765US2025273459A1Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3864US9773872B2Method of manufacturing a semiconductor device to prevent occurrence of short-channel characteristics and parasitic capacitanceRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 26, 2017·0 cites·4 claims
- 3964US9219130B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Dec 22, 2015·1 cites·20 claims
- 4062US8361255B2Copper alloy material and method of making sameHITACHI CABLE·Filed 2009·Granted Jan 29, 2013·0 cites·7 claims
- 4161US11152393B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Oct 19, 2021·0 cites·9 claims
- 4260US10510775B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 17, 2019·0 cites·20 claims
- 4360US8479231B2Program receiving apparatus, program transmission/reception system, program reception method, program, and recording mediumYAMAMOTO YOSHIKI·Filed 2009·Granted Jul 2, 2013·1 cites·25 claims
- 4457US10411036B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Sep 10, 2019·0 cites·7 claims
- 4557US10361211B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 23, 2019·0 cites·16 claims
- 4657US5671260ADigital processing apparatus using two synchronization signalsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 23, 1997·24 cites·13 claims
- 4757US2024178222A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4855US10103075B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·4 claims
- 4955US8796780B2Semiconductor device and manufacturing method thereofYAMAMOTO YOSHIKI·Filed 2009·Granted Aug 5, 2014·1 cites·2 claims
- 5055US8137489B2Copper alloy material and a method for fabricating the sameMUROGA TAKEMI·Filed 2009·Granted Mar 20, 2012·0 cites·10 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →