Inventor · disambiguated record
Yongsik Yu
Also filed as: YU YONGSIK
20 granted patents·1 pending application·881 citations·filing 2003–2023
97Inventor score
Top patents by PatentIndex Score
21 records- 0198US10002787B2Staircase encapsulation in 3D NAND fabricationLAM RES CORP·Filed 2017·Granted Jun 19, 2018·28 cites·18 claims
- 0298US7727880B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jun 1, 2010·332 cites·19 claims
- 0397US10580690B2Staircase encapsulation in 3D NAND fabricationLAM RES CORP·Filed 2018·Granted Mar 3, 2020·15 cites·14 claims
- 0497US7576006B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Aug 18, 2009·55 cites·19 claims
- 0596US7981777B1Methods of depositing stable and hermetic ashable hardmask filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 19, 2011·42 cites·16 claims
- 0696US7915166B1Diffusion barrier and etch stop filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Mar 29, 2011·70 cites·24 claims
- 0795US8669181B1Diffusion barrier and etch stop filmsYU YONGSIK·Filed 2011·Granted Mar 11, 2014·36 cites·16 claims
- 0895US7420275B1Boron-doped SIC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2006·Granted Sep 2, 2008·39 cites·20 claims
- 0994US8021486B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2010·Granted Sep 20, 2011·14 cites·18 claims
- 1094US7573061B1Low-k SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Aug 11, 2009·24 cites·14 claims
- 1194US7163889B2Film for copper diffusion barrierNOVELLUS SYSTEMS INC·Filed 2005·Granted Jan 16, 2007·29 cites·14 claims
- 1292US7968436B1Low-K SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2009·Granted Jun 28, 2011·15 cites·24 claims
- 1392US7282438B1Low-k SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2004·Granted Oct 16, 2007·53 cites·8 claims
- 1491US7842604B1Low-k b-doped SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Nov 30, 2010·17 cites·21 claims
- 1591US7704873B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Apr 27, 2010·14 cites·27 claims
- 1689US7239017B1Low-k B-doped SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2004·Granted Jul 3, 2007·42 cites·7 claims
- 1787US6967405B1Film for copper diffusion barrierYU YONGSIK·Filed 2003·Granted Nov 22, 2005·41 cites·16 claims
- 1886US8317923B1Protective self-aligned buffer layers for damascene interconnectsCHATTOPADHYAY KAUSHIK·Filed 2010·Granted Nov 27, 2012·8 cites·20 claims
- 1984US11670516B2Metal-containing passivation for high aspect ratio etchLAM RES CORP·Filed 2019·Granted Jun 6, 2023·3 cites·20 claims
- 2082US11062897B2Metal doped carbon based hard mask removal in semiconductor fabricationLAM RES CORP·Filed 2017·Granted Jul 13, 2021·4 cites·26 claims
- 2149US2025357135A1High aspect ratio etch with a metal or metalloid containing maskLAM RES CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →