Inventor · disambiguated record
Yun Hwa Choi
Also filed as: CHOI YUN HWA
39 granted patents·25 pending applications·144 citations·filing 2004–2024
96Inventor score
Files withJMJ KOREA CO LTD48SAMSUNG ELECTRONICS CO LTD9CHOI YUN HWA3FAIRCHILD KR SEMICONDUCTOR LTD2LIM SEUNG-WON1
Top patents by PatentIndex Score
64 records- 0196US11127663B2Semiconductor package having exposed heat sink for high thermal conductivityJMJ KOREA CO LTD·Filed 2020·Granted Sep 21, 2021·4 cites·21 claims
- 0296US7675148B2Power module having stacked flip-chip and method of fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Mar 9, 2010·42 cites·21 claims
- 0394US7957340B2Method of allocating frequency subband and apparatus adopting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 7, 2011·31 cites·6 claims
- 0492US8504057B2Location tracking method in coordinator-based wireless networkCHOI YUN-HWA·Filed 2005·Granted Aug 6, 2013·29 cites·13 claims
- 0591US11676931B2Semiconductor packageJMJ KOREA CO LTD·Filed 2022·Granted Jun 13, 2023·2 cites·13 claims
- 0690US11270969B2Semiconductor packageJMJ KOREA CO LTD·Filed 2020·Granted Mar 8, 2022·3 cites·18 claims
- 0789US9130065B2Power module having stacked flip-chip and method for fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2014·Granted Sep 8, 2015·8 cites·20 claims
- 0887US10855009B2Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pinJMJ KOREA CO LTD·Filed 2019·Granted Dec 1, 2020·7 cites·13 claims
- 0981US11682610B2Semiconductor package with heat radiation boardJMJ KOREA CO LTD·Filed 2020·Granted Jun 20, 2023·1 cites·18 claims
- 1074US12447550B2Ultrasonic welding system and power module package for power converting apparatus to which substrate where connection member is ultrasonic welded by using the same is appliedJMJ KOREA CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·18 claims
- 1174US11367666B2Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the sameJMJ KOREA CO LTD·Filed 2018·Granted Jun 21, 2022·2 cites·35 claims
- 1272US9685397B2Semiconductor package with clip structureJMJ KOREA CO LTD·Filed 2015·Granted Jun 20, 2017·2 cites·12 claims
- 1372US8766419B2Power module having stacked flip-chip and method of fabricating the power moduleLIM SEUNG-WON·Filed 2009·Granted Jul 1, 2014·6 cites·9 claims
- 1471US10249552B2Semiconductor package having double-sided heat dissipation structureJMJ KOREA CO LTD·Filed 2018·Granted Apr 2, 2019·2 cites·5 claims
- 1570US8538453B2Location tracking method in coordinator-based wireless networkCHOI YUN-HWA·Filed 2010·Granted Sep 17, 2013·3 cites·12 claims
- 1669US10535589B2Clip structure and semiconductor package using the sameJMJ KOREA CO LTD·Filed 2018·Granted Jan 14, 2020·1 cites·14 claims
- 1763US2016300309A1Method for inputting household accounting data for double-entry bookkeeping and household accounting system using sameCHOI YUN HWA·Filed 2014·Application pending·0 cites
- 1862US2025309026A1Semiconductor moduleJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 1962US2025246577A1Double-sided heat dissipation semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 2062US2025218894A1Semiconductor module including heat radiation systemJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 2161US2024395761A1Metal clip structure and semiconductor package including the sameJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 2261US2024379612A1Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the methodJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 2360US12451410B2Semiconductor package module including vertical terminalsJMJ KOREA CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 2460US12170260B2Semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·15 claims
- 2560US2024355723A1Semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 2660US2024290700A1Bonding substrate, semiconductor package having double-sided substrate, method of manufacturing the bonding substrate, and method of manufacturing the semiconductor package having double-sided substrateJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 2760US2024387455A1Semiconductor package and method of manufacturing the sameNHINC CO LTD·Filed 2024·Application pending·0 cites
- 2859US12400991B2Clip structure for semiconductor package and semiconductor package including the sameJMJ KOREA CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 2959US2024250057A1Semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 3059US2024234288A1Semiconductor packageJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 3158US2024297096A1Semiconductor package having heat emitting post bonded thereto and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 3257US11521920B2Plurality of power semiconductor chips between a substrate and leadframeJMJ KOREA CO LTD·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 3357US2024178094A1Semiconductor packageJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 3456US11631627B2Method of manufacturing semiconductor having double-sided substrateJMJ KOREA CO LTD·Filed 2021·Granted Apr 18, 2023·0 cites·21 claims
- 3556US11417577B2Semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2021·Granted Aug 16, 2022·0 cites·20 claims
- 3656US11171074B2Heat sink board, manufacturing method thereof, and semiconductor package including the sameJMJ KOREA CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·17 claims
- 3756US2023238297A1Semiconductor package and method of fabricating the sameJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 3855US11721615B2Coupled semiconductor packageJMJ KOREA CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·13 claims
- 3955US2023282566A1Semiconductor package having negative patterned substrate and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2022·Application pending·0 cites
- 4055US2025174521A9Semiconductor package including heat radiation structure, cooling system applying the semiconductor package, substrate including heat radiation structure and method of manufacturing the substrateJMJ KOREA CO LTD·Filed 2022·Application pending·0 cites
- 4154US12027445B2System for cooling semiconductor component, method of manufacturing the same, and semiconductor package having the systemJMJ KOREA CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·17 claims
- 4254US11482463B2Vertically attaching a chip to a substrateJMJ KOREA CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·18 claims
- 4354US11289397B2Heat sink board for a semiconductor deviceJMJ KOREA CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·16 claims
- 4453US11908824B2Semiconductor package, method of manufacturing the same and metal bridge applied to the semiconductor packageJMJ KOREA CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 4553US11908766B2Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joinedJMJ KOREA CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 4653US11362021B2Pressurizing members for semiconductor packageJMJ KOREA CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·18 claims
- 4753US2023011694A1Semiconductor package having package housing in engraved surface form and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2022·Application pending·0 cites
- 4851US11393744B2Metal powder layers between substrate, semiconductor chip and conductorJMJ KOREA CO LTD·Filed 2021·Granted Jul 19, 2022·0 cites·21 claims
- 4950US11798864B2Semiconductor package with metal post having non-vertical structureJMJ KOREA CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·12 claims
- 5050US7551594B2Method of allocating frequency subband and apparatus adopting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 23, 2009·1 cites·11 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →