Inventor · disambiguated record
Yuichiro Enomoto
Also filed as: ENOMOTO YUICHIRO
27 granted patents·11 pending applications·107 citations·filing 2010–2022
94Inventor score
Top patents by PatentIndex Score
38 records- 0198US8933144B2Curable composition for imprint, pattern-forming method and patternFUJIFILM CORP·Filed 2014·Granted Jan 13, 2015·50 cites·20 claims
- 0297US9897922B2Method of forming pattern and developer for use in the methodFUJIFILM CORP·Filed 2016·Granted Feb 20, 2018·10 cites·12 claims
- 0393US9263289B2Adhesion-promoting composition used between curable composition for imprints and substrate, and semiconductor device using the sameFUJIFILM CORP·Filed 2014·Granted Feb 16, 2016·19 cites·17 claims
- 0485US9482958B2Method of forming pattern and developer for use in the methodFUJIFILM CORP·Filed 2015·Granted Nov 1, 2016·2 cites·12 claims
- 0584US8999621B2Pattern forming method, chemical amplification resist composition and resist filmENOMOTO YUICHIRO·Filed 2010·Granted Apr 7, 2015·4 cites·58 claims
- 0682US9663671B2Curable composition for imprints and method of storing the sameFUJIFILM CORP·Filed 2014·Granted May 30, 2017·3 cites·14 claims
- 0779US9507263B2Underlay film composition for imprints and method of forming pattern and pattern formation method using the sameFUJIFILM CORP·Filed 2014·Granted Nov 29, 2016·5 cites·11 claims
- 0878US9862847B2Inkjet discharge method, pattern formation method, and patternFUJIFILM CORP·Filed 2015·Granted Jan 9, 2018·1 cites·8 claims
- 0978US9796803B2Under layer film-forming composition for imprints and method of forming patternFUJIFILM CORP·Filed 2014·Granted Oct 24, 2017·4 cites·11 claims
- 1078US9097973B2Method of forming pattern and developer for use in the methodENOMOTO YUICHIRO·Filed 2011·Granted Aug 4, 2015·2 cites·8 claims
- 1172US10248019B2Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist filmFUJIFILM CORP·Filed 2012·Granted Apr 2, 2019·1 cites·9 claims
- 1272US9709892B2Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the sameKATAOKA SHOHEI·Filed 2011·Granted Jul 18, 2017·2 cites·9 claims
- 1371US8911930B2Method of forming pattern using actinic-ray or radiation-sensitive resin composition, and patternENOMOTO YUICHIRO·Filed 2010·Granted Dec 16, 2014·2 cites·12 claims
- 1470US9868846B2Curable composition for imprints, patterning method and patternFUJIFILM CORP·Filed 2014·Granted Jan 16, 2018·1 cites·20 claims
- 1564US9551935B2Pattern forming method and resist compositionKATO KEITA·Filed 2011·Granted Jan 24, 2017·1 cites·34 claims
- 1659US12422750B2Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor deviceFUJIFILM CORP·Filed 2022·Granted Sep 23, 2025·0 cites·18 claims
- 1757US2014127629A1Method of forming patternFUJIFILM CORP·Filed 2014·Application pending·0 cites
- 1855US2017102618A1Method of forming patternFUJIFILM CORP·Filed 2016·Application pending·0 cites
- 1953US8663907B2Method of forming patternKATO KEITA·Filed 2011·Granted Mar 4, 2014·0 cites·18 claims
- 2051US10344177B2Under layer film-forming composition for imprints and method for forming patternFUJIFILM CORP·Filed 2015·Granted Jul 9, 2019·0 cites·11 claims
- 2149US8753802B2Pattern forming method, chemical amplification resist composition and resist filmFUJIFILM CORP·Filed 2012·Granted Jun 17, 2014·0 cites·16 claims
- 2248US8877828B2Method for producing curable composition for imprintsENOMOTO YUICHIRO·Filed 2012·Granted Nov 4, 2014·0 cites·19 claims
- 2348US8871642B2Method of forming pattern and developer for use in the methodENOMOTO YUICHIRO·Filed 2011·Granted Oct 28, 2014·0 cites·29 claims
- 2448US8820541B2Method for producing curable composition for imprintsENOMOTO YUICHIRO·Filed 2011·Granted Sep 2, 2014·0 cites·10 claims
- 2546US2013052431A1Curable composition for imprints, patterning method and patternENOMOTO YUICHIRO·Filed 2012·Application pending·0 cites
- 2644US9223219B2Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist filmENOMOTO YUICHIRO·Filed 2011·Granted Dec 29, 2015·0 cites·36 claims
- 2743US8808965B2Pattern forming method, pattern, chemical amplification resist composition and resist filmIWATO KAORU·Filed 2011·Granted Aug 19, 2014·0 cites·27 claims
- 2843US2015014819A1Underlying film composition for imprints and pattern forming method using the sameFUJIFILM CORP·Filed 2014·Application pending·0 cites
- 2939US10175576B2Curable composition for photo imprints, method for forming pattern, fine pattern, and method for manufacturing semiconductor deviceFUJIFILM CORP·Filed 2015·Granted Jan 8, 2019·0 cites·25 claims
- 3039US9116437B2Pattern forming method, chemical amplification resist composition and resist filmENOMOTO YUICHIRO·Filed 2010·Granted Aug 25, 2015·0 cites·17 claims
- 3138US10126653B2Pattern forming method and resist compositionIWATO KAORU·Filed 2011·Granted Nov 13, 2018·0 cites·20 claims
- 3238US2013101812A1Method of forming patternKAMIMURA SOU·Filed 2011·Application pending·0 cites
- 3337US2012028196A1Method of forming pattern and organic processing liquid for use in the methodKAMIMURA SOU·Filed 2011·Application pending·0 cites
- 3437US2012322007A1Pattern forming method, chemical amplification resist composition and resist filmKATO KEITA·Filed 2011·Application pending·0 cites
- 3534US2016026083A1Pattern forming method and method for manufacturing electronic deviceFUJIFILM CORP·Filed 2015·Application pending·0 cites
- 3634US2016195814A1Pattern formation method, electronic-device production method, and processing agentFUJIFILM CORP·Filed 2016·Application pending·0 cites
- 3733US2016009945A1Composition, cured article, laminate, method for manufacturing underlying film, method for forming pattern, pattern and method for manufacturing a resist for semiconductor processFUJIFILM CORP·Filed 2015·Application pending·0 cites
- 3832US2015228498A1Method for manufacturing adhesive film for imprints and method for forming patternsFUJIFILM CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →