Inventor · disambiguated record

Yu Gu

Also filed as: GU Yu · GU Yu-bo

44 granted patents·16 pending applications·369 citations·filing 2011–2023

98Inventor score

Technology areasH10W H10K H10P H01L C07D

Files withWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD17 STATS CHIPPAC LTD12 APPLIED MATERIALS INC11 LIN YAOJIAN5 STATS CHIPPAC PTE LTD5

Top patents by PatentIndex Score

60 records

0198US10297518B2Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale packageSTATS CHIPPAC PTE LTD·Filed 2016·Granted May 21, 2019·47 cites·23 claims
0298US10229827B2Method of redistribution layer formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 12, 2019·33 cites·13 claims
0398US10211072B2Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 19, 2019·37 cites·17 claims
0498US8810024B2Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect unitsLIN YAOJIAN·Filed 2012·Granted Aug 19, 2014·62 cites·32 claims
0597US9842798B2Semiconductor device and method of forming a PoP device with embedded vertical interconnect unitsSTATS CHIPPAC LTD·Filed 2013·Granted Dec 12, 2017·31 cites·6 claims
0696US11024561B2Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect unitsSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 1, 2021·3 cites·25 claims
0796US10049964B2Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect unitsSTATS CHIPPAC LTD·Filed 2013·Granted Aug 14, 2018·21 cites·22 claims
0894US9385102B2Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale packageSTATS CHIPPAC LTD·Filed 2012·Granted Jul 5, 2016·17 cites·27 claims
0994US9318404B2Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP packageSTATS CHIPPAC LTD·Filed 2013·Granted Apr 19, 2016·19 cites·21 claims
1094US8456002B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefLIN YAOJIAN·Filed 2011·Granted Jun 4, 2013·13 cites·25 claims
1193US9837303B2Semiconductor method and device of forming a fan-out device with PWB vertical interconnect unitsSTATS CHIPPAC LTD·Filed 2013·Granted Dec 5, 2017·16 cites·23 claims
1290US9875973B2Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layersSTATS CHIPPAC LTD·Filed 2013·Granted Jan 23, 2018·11 cites·17 claims
1390US9865525B2Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect unitsSTATS CHIPPAC LTD·Filed 2014·Granted Jan 9, 2018·9 cites·25 claims
1489US9082780B2Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layerLIN YAOJIAN·Filed 2012·Granted Jul 14, 2015·10 cites·25 claims
1589US8492203B2Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layersLIN YAOJIAN·Filed 2011·Granted Jul 23, 2013·10 cites·13 claims
1687US11283029B2Thermally activated delayed fluorescence material, organic electroluminescent device, and display panelWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2019·Granted Mar 22, 2022·3 cites·19 claims
1787US10446479B2Semiconductor device and method of forming a PoP device with embedded vertical interconnect unitsSTATS CHIPPAC PTE LTD·Filed 2017·Granted Oct 15, 2019·4 cites·6 claims
1885US10707150B2Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect unitsSTATS CHIPPAC PTE LTD·Filed 2018·Granted Jul 7, 2020·3 cites·23 claims
1983US12085741B2Method for preparing super-resolution lens based on metal-dielectric strip array, and using method of super-resolution lensINST OPTICS & ELECTRONICS CAS·Filed 2021·Granted Sep 10, 2024·1 cites·13 claims
2082US9666500B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2015·Granted May 30, 2017·2 cites·22 claims
2181US11205756B2Green light thermally activated delayed fluorescence (TADF) material and application thereofWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2019·Granted Dec 21, 2021·3 cites·8 claims
2281US10170385B2Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSPSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jan 1, 2019·3 cites·21 claims
2378US10954245B2Thermal active delay fluorescent material, method for manufacturing same, and organic light-emitting diode deviceWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2019·Granted Mar 23, 2021·1 cites·10 claims
2477US11349085B2Acridine derivatives and organic electroluminescent deviceWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2018·Granted May 31, 2022·1 cites·10 claims
2577US8759155B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2013·Granted Jun 24, 2014·2 cites·24 claims
2675US10818841B2Method of fabricating organic light emitting diode displayWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2018·Granted Oct 27, 2020·1 cites·18 claims
2774US9252092B2Semiconductor device and method of forming through mold hole with alignment and dimension controlSTATS CHIPPAC LTD·Filed 2013·Granted Feb 2, 2016·3 cites·29 claims
2870US11355358B2Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applicationsAPPLIED MATERIALS INC·Filed 2019·Granted Jun 7, 2022·1 cites·19 claims
2969US11373803B2Method of forming a magnetic core on a substrateAPPLIED MATERIALS INC·Filed 2018·Granted Jun 28, 2022·1 cites·17 claims
3069US10276424B2Method and apparatus for wafer level packagingAPPLIED MATERIALS INC·Filed 2017·Granted Apr 30, 2019·1 cites·20 claims
3167US11791094B2Semiconductor substrate having magnetic core inductorAPPLIED MATERIALS INC·Filed 2021·Granted Oct 17, 2023·0 cites·19 claims
3266US11362284B2Efficient blue-green to orange-red thermally activated delayed fluorescence material, manufacture method, and application thereofWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·10 claims
3362US11515488B2Thermally activated delayed fluorescence material having red, green, or blue color, synthesis method thereof, and application thereofWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2019·Granted Nov 29, 2022·0 cites·7 claims
3462US10790468B2Organic electroluminescent device and method for preparing the sameWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2019·Granted Sep 29, 2020·0 cites·10 claims
3560US9087930B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2014·Granted Jul 21, 2015·0 cites·25 claims
3659US2024130156A1Light-Emitting Element and Display PanelWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2023·Application pending·0 cites
3759US2025056961A1Display panelsWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2023·Application pending·0 cites
3859US2025098444A1Display panels and display devicesWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2023·Application pending·0 cites
3959US2019181019A1Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
4059US2025248205A1Display panel and display deviceWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2023·Application pending·0 cites
4158US11907729B2Computer system and booting method thereofASUSTEK COMP INC·Filed 2022·Granted Feb 20, 2024·0 cites·9 claims
4258US11374179B2Dithiazine-based hole transport material, preparing method thereof, and organic light-emitting deviceWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2019·Granted Jun 28, 2022·0 cites·5 claims
4358US2025113703A1Display panel and display deviceWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2023·Application pending·0 cites
4457US2025344575A1Display panelWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2023·Application pending·0 cites
4554US12063821B2Display panelWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
4652US9520365B2Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layersSTATS CHIPPAC LTD·Filed 2012·Granted Dec 13, 2016·0 cites·24 claims
4750US11152600B2Organic light-emitting diode display panel and manufacture method thereofWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2019·Granted Oct 19, 2021·0 cites·10 claims
4850US10636696B1Methods for forming vias in polymer layersAPPLIED MATERIALS INC·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
4949US12096661B2OLED display panel and OLED display deviceWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
5046US2016172167A1Copper material for high-purity copper sputtering target, and high-purity copper sputtering targetMITSUBISHI MATERIALS CORP·Filed 2014·Application pending·0 cites

Showing the top 50 of 60 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →