Inventor · disambiguated record
Yu-Chen Lee
Also filed as: LEE YU-CHEN
29 granted patents·24 pending applications·106 citations·filing 2005–2025
95Inventor score
Files withASUSTEK COMP INC22TAIWAN SEMICONDUCTOR MFG CO LTD14WU CHAO-CHUNG8IND TECH RES INST2LEE YU-CHEN2
Top patents by PatentIndex Score
53 records- 0195US12300568B2High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·2 cites·20 claims
- 0291US7775816B1Electronic device case structure having function of ejecting peripheral deviceWISTRON CORP·Filed 2009·Granted Aug 17, 2010·15 cites·12 claims
- 0383US7881060B2Heat-dissipation module and electronic apparatus having the sameASUSTEK COMP INC·Filed 2009·Granted Feb 1, 2011·10 cites·20 claims
- 0483US7637748B2Electronic device and connector and card insertion method thereofASUSTEK COMP INC·Filed 2008·Granted Dec 29, 2009·18 cites·11 claims
- 0583US2024379494A1High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0681US12424511B2High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0780US2025357227A1Methods of forming anchor-containing underfill structures for a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0876US8205069B2Computer system with dual BIOSWU CHAO-CHUNG·Filed 2009·Granted Jun 19, 2012·6 cites·6 claims
- 0975US2024363551A1Semiconductor die package with ring structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1072US12315768B2Package assembly including lid with additional stress mitigating feet and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 1172US10128946B2Visible light communication device and driving method thereofIND TECH RES INST·Filed 2016·Granted Nov 13, 2018·3 cites·15 claims
- 1272US2025266306A1Package assmebly including lid with additional stress mtitgating feet and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1370US8274271B2Motherboard with overclocking and overvolting functionsWU CHAO-CHUNG·Filed 2009·Granted Sep 25, 2012·4 cites·8 claims
- 1468US8533519B2Motherboard with overclocking function for a plurality of components therein such that the overclocking function for the plurality of the components are enabled via an external input deviceWU CHAO-CHUNG·Filed 2010·Granted Sep 10, 2013·2 cites·9 claims
- 1567US12068260B2Semiconductor die package with ring structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 1667US8055889B2BIOS management device and method for managing BIOS setting valueASUSTEK COMP INC·Filed 2008·Granted Nov 8, 2011·5 cites·16 claims
- 1767USD611916SSet of buttons on motherboardASUSTEK COMP INC·Filed 2008·Granted Mar 16, 2010·15 cites·1 claims
- 1865US8239664B2Computer system having dual bios program protecting function and control method thereofWU CHAO-CHUNG·Filed 2009·Granted Aug 7, 2012·3 cites·12 claims
- 1965US7955100B2Connector and electronic device having the sameASUSTEK COMP INC·Filed 2010·Granted Jun 7, 2011·5 cites·14 claims
- 2065US7857628B2Electronic device and connector and card insertion method thereofASUSTEK COMP INC·Filed 2009·Granted Dec 28, 2010·7 cites·11 claims
- 2165US2023420314A1Anchor-containing underfill structures for a chip package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2263US10394343B2Keyboard control circuitASUSTEK COMP INC·Filed 2016·Granted Aug 27, 2019·1 cites·9 claims
- 2363US8656148B2Device information collecting method and system in computer systemLEE YU-CHEN·Filed 2010·Granted Feb 18, 2014·2 cites·12 claims
- 2459US2025079334A1Reinforcement structures for multi-die semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2557US2025070046A1Integrated circuit and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2657US2024321772A1Reinforcement structures for chip-interposer and interposer-substrate bonding and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2754US2023411234A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2854US2025039764A1Electronic device that improves wireless network transmission quality and operating method thereforASUSTEK COMP INC·Filed 2023·Application pending·0 cites
- 2953US9713269B2Fixing structure, electronic device and method for assembling an electronic deviceWISTRON CORP·Filed 2015·Granted Jul 18, 2017·0 cites·20 claims
- 3053US2024222287A1Package including composite interposer and/or composite packaging substrate and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3152US8258770B2Multi-phase voltage regulator module and method controlling the sameWU CHAO-CHUNG·Filed 2009·Granted Sep 4, 2012·4 cites·14 claims
- 3251US10952348B2Heat dissipation deviceASUSTEK COMP INC·Filed 2019·Granted Mar 16, 2021·0 cites·9 claims
- 3351US2012226897A1Computer system with dual biosWU CHAO-CHUNG·Filed 2012·Application pending·0 cites
- 3450US2012023321A1Computer systemWU CHAO-CHUNG·Filed 2011·Application pending·0 cites
- 3549US7670165B2Restriction mechanism for cardASUSTEK COMP INC·Filed 2008·Granted Mar 2, 2010·2 cites·14 claims
- 3649US2009276554A1Computer system and data-transmission control methodASUSTEK COMP INC·Filed 2009·Application pending·0 cites
- 3749US2012246498A1Motherboard with overclocking and overvolting functionsWU CHAO-CHUNG·Filed 2012·Application pending·0 cites
- 3849US2009276552A1Motherboard and power managing method for graphic card installed thereonASUSTEK COMP INC·Filed 2009·Application pending·0 cites
- 3948US2009210690A1Method of updating basic input output system and module and computer system implementing the sameASUSTEK COMP INC·Filed 2008·Application pending·0 cites
- 4048US2007254528A1Electronic deviceASUSTEK COMP INC·Filed 2007·Application pending·0 cites
- 4147US11415435B2Encoder and signal processing method using the sameIND TECH RES INST·Filed 2020·Granted Aug 16, 2022·0 cites·22 claims
- 4247US2010115300A1Method and device for adjusting clock frequency and operating voltage of computer systemASUSTEK COMP INC·Filed 2009·Application pending·0 cites
- 4346US2006115689A1Electronic device and battery replacing method thereofBENQ CORP·Filed 2005·Application pending·0 cites
- 4446US2008101046A1MotherboardASUSTEK COMP INC·Filed 2007·Application pending·0 cites
- 4546US2023065958A1Dynamic three-dimensional meridian system of human bodyUNIV CHINA MEDICAL·Filed 2022·Application pending·0 cites
- 4646US2009259788A1Motherboard having time calculating device and time calculating method thereofASUSTEK COMP INC·Filed 2009·Application pending·0 cites
- 4745US2015091803A1Multi-touch input method for touch input deviceASUSTEK COMP INC·Filed 2014·Application pending·0 cites
- 4844US11435597B2Displaying deviceASUSTEK COMP INC·Filed 2019·Granted Sep 6, 2022·0 cites·5 claims
- 4943US10114427B2Input/output module baffle and motherboard with the sameASUSTEK COMP INC·Filed 2017·Granted Oct 30, 2018·0 cites·6 claims
- 5043US9317085B2Electronic device and clock rates controlling method of overclocking operationCHUNG MING-HUNG·Filed 2013·Granted Apr 19, 2016·0 cites·10 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →