Inventor · disambiguated record
Yue Li
Also filed as: LI YUE · Li yue-xun
13 granted patents·20 pending applications·58 citations·filing 2007–2024
87Inventor score
Files withQUALCOMM INC28ATI TECHNOLOGIES ULC2AUDEN TECHNO CORP1MCLELLAN NEIL1UNIV OXFORD INNOVATION LTD1
Top patents by PatentIndex Score
33 records- 0196US9263186B2DC/ AC dual function Power Delivery Network (PDN) decoupling capacitorQUALCOMM INC·Filed 2013·Granted Feb 16, 2016·38 cites·34 claims
- 0289US12062648B2Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Aug 13, 2024·2 cites·33 claims
- 0388US10321575B2Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive componentsQUALCOMM INC·Filed 2015·Granted Jun 11, 2019·8 cites·26 claims
- 0471US10170232B2Toroid inductor with reduced electromagnetic field leakageQUALCOMM INC·Filed 2015·Granted Jan 1, 2019·1 cites·16 claims
- 0570US12512401B2Integrated device substrate including embedded electromagnetic isolation structureQUALCOMM INC·Filed 2024·Granted Dec 30, 2025·0 cites·10 claims
- 0670US9041176B2Hybrid semiconductor module structureQUALCOMM INC·Filed 2013·Granted May 26, 2015·3 cites·30 claims
- 0767US8012874B2Semiconductor chip substrate with multi-capacitor footprintATI TECHNOLOGIES ULC·Filed 2007·Granted Sep 6, 2011·5 cites·13 claims
- 0860US2025273627A1Package comprising a base substrate and integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0960US2025246582A1Stacked integrated circuit devices including logic die and memory stacksQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1060US2025201786A1Package comprising integrated devices and a passive deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1159US10231324B2Staggered power structure in a power distribution network (PDN)QUALCOMM INC·Filed 2014·Granted Mar 12, 2019·1 cites·30 claims
- 1259US2025246569A1Stacked integrated circuit devices with face-to-face connections between logic and memory diesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1358US2025300080A1INTEGRATED CIRCUITS (ICs) HAVING SEPARATE SIGNAL AND POWER DISTRIBUTION NETWORK (PDN) INTERCONNECT STRUCTURES FOR REDUCED POWER SIGNAL ROUTING CONGESTION AND PATH LENGTHS, AND RELATED THREE-DIMENSIONAL (3D) ICs (3DICs) AND FABRICATION METHODSQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1458US2025293112A1Package comprising substrates, integrated devices and a heat sinkQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1557US2025062285A1Stacked integrated circuit devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1657US2024421119A1Flexible under-bump metallization (ubm) sizes and patterning, and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1757US2025069965A1Package comprising a substrate with an embedded frameQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1856US2025096207A1Package comprising a bridge located between metallization portionsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1954US2024363605A1Stacked integrated circuit device including integrated capacitor deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2052US11380613B2Repurposed seed layer for high frequency noise control and electrostatic discharge connectionQUALCOMM INC·Filed 2020·Granted Jul 5, 2022·0 cites·12 claims
- 2152US2024038831A1Package with a substrate comprising embedded stacked trench capacitor devicesQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2248US12381326B2Multifunctional antenna structureAUDEN TECHNO CORP·Filed 2023·Granted Aug 5, 2025·0 cites·10 claims
- 2348US11817406B2Semiconductor die employing repurposed seed layer for forming additional signal paths to back end-of-line (BEOL) structure, and related integrated circuit (IC) packages and fabrication methodsQUALCOMM INC·Filed 2021·Granted Nov 14, 2023·0 cites·29 claims
- 2448US9998085B2WaveguideUNIV OXFORD INNOVATION LTD·Filed 2014·Granted Jun 12, 2018·0 cites·13 claims
- 2547US2019043817A1Land grid based multi size pad packageQUALCOMM INC·Filed 2018·Application pending·0 cites
- 2646US2008245555A1Circuit substrate with plated through hole structure and methodATI TECHNOLOGIES ULC·Filed 2007·Application pending·0 cites
- 2743US11676922B2Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layerQUALCOMM INC·Filed 2019·Granted Jun 13, 2023·0 cites·28 claims
- 2843US2009032941A1Under Bump Routing Layer Method and ApparatusMCLELLAN NEIL·Filed 2007·Application pending·0 cites
- 2943US2018053740A1Land grid based multi size pad packageQUALCOMM INC·Filed 2016·Application pending·0 cites
- 3040US2020176417A1Stacked embedded passive substrate structureQUALCOMM INC·Filed 2018·Application pending·0 cites
- 3140US2015364438A1Balanced current distribution structure for large current deliveryQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3235US2017005160A1Anchoring conductive material in semiconductor devicesQUALCOMM INC·Filed 2015·Application pending·0 cites
- 3332US2017373032A1Redistribution layer (rdl) fan-out wafer level packaging (fowlp) structureQUALCOMM INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →