Inventor · disambiguated record
Yun Liu
Also filed as: LIU YUN · LIU YUN-JEN
11 granted patents·6 pending applications·15 citations·filing 2010–2023
83Inventor score
Files withST MICROELECTRONICS PTE LTD7GAN KAH WEE4KONINKLIJKE PHILIPS NV2GUANGZHOU XIHE E COMMERCE CO LTD1JIN YONGGANG1
Top patents by PatentIndex Score
17 records- 0182US8617987B2Through hole via filling using electroless platingGAN KAH WEE·Filed 2010·Granted Dec 31, 2013·7 cites·9 claims
- 0270US8766422B2Through hole via filling using electroless platingGAN KAH WEE·Filed 2011·Granted Jul 1, 2014·3 cites·3 claims
- 0364US11562937B2Semiconductor package with protected sidewall and method of forming the sameST MICROELECTRONICS PTE LTD·Filed 2021·Granted Jan 24, 2023·0 cites·19 claims
- 0464US8796139B2Embedded wafer level ball grid array bar systems and methodsST MICROELECTRONICS PTE LTD·Filed 2012·Granted Aug 5, 2014·2 cites·18 claims
- 0563US2018229334A1Cored solder wire with rosin flux and thermoset materialST MICROELECTRONICS PTE LTD·Filed 2018·Application pending·0 cites
- 0660US8860228B2Electronic device including electrically conductive vias having different cross-sectional areas and related methodsST MICROELECTRONICS PTE LTD·Filed 2012·Granted Oct 14, 2014·1 cites·24 claims
- 0758US2016184938A1Cored solder wire with rosin flux and thermoset materialST MICROELECTRONICS PTE LTD·Filed 2014·Application pending·0 cites
- 0857USD994247SPet chew toyGUANGZHOU XIHE E COMMERCE CO LTD·Filed 2023·Granted Aug 1, 2023·2 cites·1 claims
- 0955US10879084B2Molded packageKONINKLIJKE PHILIPS NV·Filed 2020·Granted Dec 29, 2020·0 cites·8 claims
- 1052US10910287B2Semiconductor package with protected sidewall and method of forming the sameST MICROELECTRONICS PTE LTD·Filed 2019·Granted Feb 2, 2021·0 cites·12 claims
- 1152US10629456B2Molded package and method of manufactureKONINKLIJKE PHILIPS NV·Filed 2015·Granted Apr 21, 2020·0 cites·10 claims
- 1248US2014187319A1Game apparatus and board device thereofOZAKI INT CO LTD·Filed 2013·Application pending·0 cites
- 1339US10128207B2Semiconductor packages with pillar and bump structuresST MICROELECTRONICS PTE LTD·Filed 2015·Granted Nov 13, 2018·0 cites·14 claims
- 1438US8912653B2Plasma treatment on semiconductor wafersGAN KAH WEE·Filed 2011·Granted Dec 16, 2014·0 cites·13 claims
- 1535US2012168943A1Plasma treatment on semiconductor wafersGAN KAH WEE·Filed 2010·Application pending·0 cites
- 1635US2012282767A1Method for producing a two-sided fan-out wafer level package with electrically conductive interconnects, and a corresponding semiconductor packageJIN YONGGANG·Filed 2011·Application pending·0 cites
- 1734US2014057394A1Method for making a double-sided fanout semiconductor package with embedded surface mount devices, and product madeRAMASAMY ANANDAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →