Inventor · disambiguated record
Yukio Morishige
Also filed as: MORISHIGE YUKIO
32 granted patents·10 pending applications·591 citations·filing 1986–2017
97Inventor score
Top patents by PatentIndex Score
42 records- 0199US9878397B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Jan 30, 2018·50 cites·3 claims
- 0297US7473866B2Laser processing apparatusDISCO CORP·Filed 2006·Granted Jan 6, 2009·124 cites·3 claims
- 0391US7179722B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Feb 20, 2007·20 cites·5 claims
- 0490US7601616B2Wafer laser processing methodDISCO CORP·Filed 2007·Granted Oct 13, 2009·15 cites·2 claims
- 0588US7585751B2Wafer dividing method using laser beam with an annular spotDISCO CORP·Filed 2008·Granted Sep 8, 2009·14 cites·1 claims
- 0687US6879605B2Method and apparatus for performing pattern defect repair using Q-switched mode-locked pulse laserLASERFRONT TECHNOLOGIES INC·Filed 2001·Granted Apr 12, 2005·70 cites·74 claims
- 0787US5343271AExposure apparatus for drawing patterns on substratesNEC CORP·Filed 1993·Granted Aug 30, 1994·51 cites·8 claims
- 0886US7557904B2Wafer holding mechanismDISCO CORP·Filed 2006·Granted Jul 7, 2009·12 cites·5 claims
- 0981US8263900B2Laser beam processing machineMAEHARA JUN·Filed 2010·Granted Sep 11, 2012·11 cites·4 claims
- 1080US9475152B2Laser processing method and laser processing apparatusDISCO CORP·Filed 2014·Granted Oct 25, 2016·4 cites·6 claims
- 1177US4711790AOptical CVD method with a strong optical intensity used during an initial period and device thereforNEC CORP·Filed 1986·Granted Dec 8, 1987·33 cites·9 claims
- 1273US7449396B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Nov 11, 2008·4 cites·3 claims
- 1371US7232741B2Wafer dividing methodDISCO CORP·Filed 2004·Granted Jun 19, 2007·13 cites·5 claims
- 1471US4976930AMethod and apparatus for inducing photochemical reactionNEC CORP·Filed 1989·Granted Dec 11, 1990·24 cites·7 claims
- 1571US4873413AMethod and apparatus for writing a line on a patterned substrateNEC CORP·Filed 1987·Granted Oct 10, 1989·38 cites·5 claims
- 1670US6678304B2Laser correction method and apparatusNEC CORP·Filed 2001·Granted Jan 13, 2004·10 cites·9 claims
- 1770US6333130B1Method and apparatus for correcting defects in photomaskNEC CORP·Filed 2000·Granted Dec 25, 2001·11 cites·12 claims
- 1868US7642485B2Laser beam processing machineDISCO CORP·Filed 2006·Granted Jan 5, 2010·2 cites·1 claims
- 1967US7553777B2Silicon wafer laser processing method and laser beam processing machineDISCO CORP·Filed 2005·Granted Jun 30, 2009·2 cites·4 claims
- 2066US7713845B2Laser processing method for waferDISCO CORP·Filed 2007·Granted May 11, 2010·2 cites·5 claims
- 2165US6496255B2Measurement of crystal face orientationNEC CORP·Filed 2001·Granted Dec 17, 2002·5 cites·46 claims
- 2262US7582541B2Wafer laser processing methodDISCO CORP·Filed 2007·Granted Sep 1, 2009·1 cites·2 claims
- 2362US6926801B2Laser machining method and apparatusLASERFRONT TECHNOLOGIES INC·Filed 2003·Granted Aug 9, 2005·9 cites·12 claims
- 2459US7405376B2Processing apparatus using laser beamDISCO CORP·Filed 2004·Granted Jul 29, 2008·7 cites·5 claims
- 2559US7332415B2Silicon wafer dividing method and apparatusDISCO CORP·Filed 2004·Granted Feb 19, 2008·6 cites·9 claims
- 2658US6136096AMethod and apparatus for correcting defects in photomaskNEC CORP·Filed 1997·Granted Oct 24, 2000·18 cites·10 claims
- 2755US5628926AMethod of forming via holes in a insulation film and method of cutting the insulation filmNEC CORP·Filed 1994·Granted May 13, 1997·24 cites·38 claims
- 2853US6336975B1Thin film forming equipment and methodNEC CORP·Filed 2000·Granted Jan 8, 2002·4 cites·4 claims
- 2950US6890387B2Method and device for correcting pattern film on a semiconductor substrateLASERFRONT TECHNOLOGIES INC·Filed 2001·Granted May 10, 2005·5 cites·14 claims
- 3049US2008003708A1Method of processing sapphire substrateHOSHINO HITOSHI·Filed 2007·Application pending·0 cites
- 3147US6733848B2Thin film forming equipment and methodNEC CORP·Filed 2001·Granted May 11, 2004·2 cites·6 claims
- 3243US7166167B2Laser CVD device and laser CVD methodLASERFRONT TECHNOLOGIES INC·Filed 2003·Granted Jan 23, 2007·0 cites·2 claims
- 3341US2005082267A1Laser beam machineFiled 2004·Application pending·0 cites
- 3441US2005109742A1Processing method using laser beamFiled 2004·Application pending·0 cites
- 3541US2006009008A1Method for the laser processing of a waferDISCO CORP·Filed 2005·Application pending·0 cites
- 3641US2005069000A1Dividing method and apparatus for sheet-shaped workpieceFiled 2004·Application pending·0 cites
- 3741US2005082264A1Laser beam machineFiled 2004·Application pending·0 cites
- 3840US2005127299A1Apparatus for checking a laser processed deteriorated layerFiled 2004·Application pending·0 cites
- 3940US2005067392A1Dividing method and apparatus for sheet-shaped workpieceFiled 2004·Application pending·0 cites
- 4040US2005061789A1Laser beam machineFiled 2004·Application pending·0 cites
- 4140US2005178752A1Method and device for correcting pattern film on a semiconductor substrateLASERFRONT TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 4236US6664524B2Focusing methodNEC CORP·Filed 2001·Granted Dec 16, 2003·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →