Inventor · disambiguated record
Yuichiro Morozumi
Also filed as: MOROZUMI YUICHIRO
17 granted patents·10 pending applications·78 citations·filing 2001–2024
91Inventor score
Top patents by PatentIndex Score
27 records- 0191US9230799B2Method for fabricating semiconductor device and the semiconductor deviceTERAMOTO AKINOBU·Filed 2012·Granted Jan 5, 2016·14 cites·11 claims
- 0291US8288241B2Semiconductor device, method of manufacturing the same and adsorption site blocking atomic layer deposition methodHIROTA TOSHIYUKI·Filed 2011·Granted Oct 16, 2012·14 cites·20 claims
- 0382US9293543B2Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Mar 22, 2016·5 cites·19 claims
- 0481US6313047B2MOCVD method of tantalum oxide filmTOKYO ELECTRON LTD·Filed 2001·Granted Nov 6, 2001·27 cites·22 claims
- 0576US10133265B2Method and apparatus for autonomous identification of particle contamination due to isolated process events and systematic trendsTOKYO ELECTRON LTD·Filed 2016·Granted Nov 20, 2018·2 cites·20 claims
- 0672US9390912B2Film forming methodTOKYO ELECTRON LTD·Filed 2014·Granted Jul 12, 2016·2 cites·23 claims
- 0769US9405289B2Method and apparatus for autonomous identification of particle contamination due to isolated process events and systematic trendsTOKYO ELECTRON LTD·Filed 2012·Granted Aug 2, 2016·2 cites·20 claims
- 0864US9103029B2Processing apparatus and film forming methodWAMURA YU·Filed 2011·Granted Aug 11, 2015·2 cites·10 claims
- 0961US9034718B2Film forming method for forming boron-added silicon nitride filmSUZUKI KEISUKE·Filed 2012·Granted May 19, 2015·1 cites·4 claims
- 1061US2023137865A1Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1161US2024401199A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1254US7041546B2Film forming method for depositing a plurality of high-k dielectric filmsTOKYO ELECTRON LTD·Filed 2003·Granted May 9, 2006·5 cites·4 claims
- 1354US2014367699A1Method for fabricating semiconductor device and the semiconductor deviceUNIV TOHOKU·Filed 2014·Application pending·0 cites
- 1453US7368384B2Film formation apparatus and method of using the sameTOKYO ELECTRON LTD·Filed 2005·Granted May 6, 2008·4 cites·13 claims
- 1548US9472394B2Method of forming silicon oxide filmTOKYO ELECTRON LTD·Filed 2014·Granted Oct 18, 2016·0 cites·13 claims
- 1643US2008066677A1Semiconductor manufacturing systemMOROZUMI YUICHIRO·Filed 2007·Application pending·0 cites
- 1743US2007243691A1Manufacturing method of semiconductor deviceFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1841US8642127B2Method of forming titanium nitride filmMOROZUMI YUICHIRO·Filed 2012·Granted Feb 4, 2014·0 cites·7 claims
- 1941US2013109197A1Method of forming silicon oxide filmTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 2040US8735304B2Film forming method, film forming apparatus, and storage mediumMOROZUMI YUICHIRO·Filed 2012·Granted May 27, 2014·0 cites·4 claims
- 2139US8277891B2Method for suppressing particle generation during semiconductor manufacturingMOROZUMI YUICHIRO·Filed 2010·Granted Oct 2, 2012·0 cites·8 claims
- 2239US2012309163A1Method of forming titanium oxide film having rutile crystalline structureKIYOMURA TAKAKAZU·Filed 2012·Application pending·0 cites
- 2336US2011303152A1Support structure, processing container structure and processing apparatusASARI SHINJI·Filed 2011·Application pending·0 cites
- 2435US8389421B2Film formation method and film formation apparatusHARADA KATSUSHIGE·Filed 2011·Granted Mar 5, 2013·0 cites·8 claims
- 2535US2012240857A1Vertical heat treatment apparatusMOROZUMI YUICHIRO·Filed 2011·Application pending·0 cites
- 2634US2012199067A1Film-forming apparatusMOROZUMI YUICHIRO·Filed 2012·Application pending·0 cites
- 2733US8815112B2Liquid processing method, recording medium having recorded program for executing liquid processing method therein and liquid processing apparatusMIZUNO TSUYOSHI·Filed 2011·Granted Aug 26, 2014·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →