Inventor · disambiguated record
Yutaka Onozuka
Also filed as: ONOZUKA YUTAKA
37 granted patents·11 pending applications·372 citations·filing 1997–2025
97Inventor score
Top patents by PatentIndex Score
48 records- 0193US7223632B2Active matrix substrate, method of manufacturing the same, and display deviceTOSHIBA KK·Filed 2005·Granted May 29, 2007·23 cites·2 claims
- 0293US6885030B2Active matrix substrate, method of manufacturing the same, and display deviceTOSHIBA KK·Filed 2003·Granted Apr 26, 2005·59 cites·15 claims
- 0391US7081642B2Active matrix substrate display deviceTOSHIBA KK·Filed 2005·Granted Jul 25, 2006·18 cites·13 claims
- 0489US6977710B2Display device with an adhesion layer and a thin glass layer on adhesion layer and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Dec 20, 2005·43 cites·10 claims
- 0587US6831727B2Display device with adhesion layers in pixel & peripheral regions of plastic substrate and thin glass layer on adhesion layersTOSHIBA KK·Filed 2003·Granted Dec 14, 2004·39 cites·9 claims
- 0686US6956638B2Display device and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Oct 18, 2005·33 cites·8 claims
- 0785US7863617B2Active matrix type display device and method of manufacturing the sameTOSHIBA KK·Filed 2008·Granted Jan 4, 2011·5 cites·3 claims
- 0885US6078365AActive matrix liquid crystal panel having an active layer and an intervening layer formed of a common semiconductor filmTOSHIBA KK·Filed 1997·Granted Jun 20, 2000·64 cites·21 claims
- 0984US8980697B2Method of fabricating chip scale packageTOSHIBA KK·Filed 2013·Granted Mar 17, 2015·5 cites·8 claims
- 1082US9548279B2Connection member, semiconductor device, and stacked structureTOSHIBA KK·Filed 2014·Granted Jan 17, 2017·5 cites·6 claims
- 1180US7612438B2Active matrix substrate with height control memberTOSHIBA KK·Filed 2005·Granted Nov 3, 2009·7 cites·7 claims
- 1278US7407839B2Method of manufacturing active matrix substrate with height control memberTOSHIBA KK·Filed 2005·Granted Aug 5, 2008·6 cites·8 claims
- 1378US6828657B2Active matrix substrate and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Dec 7, 2004·21 cites·13 claims
- 1477US7906823B2MEMS apparatus and method of manufacturing the sameTOSHIBA KK·Filed 2008·Granted Mar 15, 2011·5 cites·9 claims
- 1574US7875481B2Semiconductor apparatus and method for manufacturing the sameTOSHIBA KK·Filed 2008·Granted Jan 25, 2011·5 cites·15 claims
- 1674US7763957B2Active matrix type display device and method of manufacturing the sameTOSHIBA KK·Filed 2007·Granted Jul 27, 2010·2 cites·5 claims
- 1772US8008760B2Integrated semiconductor deviceTOSHIBA KK·Filed 2009·Granted Aug 30, 2011·3 cites·8 claims
- 1868US6936912B2Active matrix substrate with height control memberTOSHIBA KK·Filed 2002·Granted Aug 30, 2005·11 cites·2 claims
- 1967US7893525B2Semiconductor device having an adhesive portion with a stacked structure and method for manufacturing the sameTOSHIBA KK·Filed 2009·Granted Feb 22, 2011·3 cites·6 claims
- 2067US6987284B2Active matrix type display device and method of manufacturing the sameTOSHIBA KK·Filed 2003·Granted Jan 17, 2006·7 cites·3 claims
- 2166US8951905B2Semiconductor device and production method thereofTOSHIBA KK·Filed 2013·Granted Feb 10, 2015·1 cites·10 claims
- 2264US2025095948A1Electronic component and charged particle beam irradiation apparatusNUFLARE TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2361US9502367B2Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the capTOSHIBA KK·Filed 2015·Granted Nov 22, 2016·1 cites·9 claims
- 2459US2024321662A1Electronic component and method for manufacturing the sameTOSHIBA KK·Filed 2023·Application pending·0 cites
- 2558US9913367B2Wiring board and method of manufacturing the sameTOSHIBA KK·Filed 2014·Granted Mar 6, 2018·0 cites·15 claims
- 2657US7180237B2Active matrix substrate, free of a spacer layer in a pixel regionTOSHIBA KK·Filed 2004·Granted Feb 20, 2007·6 cites·8 claims
- 2754US10379440B2Pattern forming method, semiconductor device, and manufacturing method thereofTOSHIBA KK·Filed 2017·Granted Aug 13, 2019·0 cites·5 claims
- 2854US10126168B1Optical sensorTOSHIBA KK·Filed 2018·Granted Nov 13, 2018·0 cites·20 claims
- 2954US7541224B2Active matrix type display device and method of manufacturing the sameTOSHIBA KK·Filed 2005·Granted Jun 2, 2009·0 cites·1 claims
- 3053US10337994B2Sample liquid measuring device and measuring methodTOSHIBA KK·Filed 2017·Granted Jul 2, 2019·0 cites·20 claims
- 3153US7265385B2Active matrix type display device and method of manufacturing the sameTOSHIBA KK·Filed 2005·Granted Sep 4, 2007·0 cites·2 claims
- 3252US2025293214A1Electronic deviceTOSHIBA KK·Filed 2025·Application pending·0 cites
- 3351US10646899B2Cell sorterTOSHIBA KK·Filed 2018·Granted May 12, 2020·0 cites·19 claims
- 3449US2007273018A1Semiconductor apparatus and method for manufacturing the sameTOSHIBA KK·Filed 2007·Application pending·0 cites
- 3548US10337976B2Microanalysis chipTOSHIBA KK·Filed 2015·Granted Jul 2, 2019·0 cites·6 claims
- 3648US9490237B2Semiconductor package including a plurality of chipsTOSHIBA KK·Filed 2015·Granted Nov 8, 2016·0 cites·5 claims
- 3748US2019283284A1Method of manufacturing microchannelTOSHIBA KK·Filed 2018·Application pending·0 cites
- 3847US9698482B2Antenna deviceTOSHIBA KK·Filed 2014·Granted Jul 4, 2017·0 cites·10 claims
- 3947US2017148713A1Connection member, semiconductor device, and stacked structureTOSHIBA KK·Filed 2016·Application pending·0 cites
- 4046US9895691B2Analysis package for detecting particles in a sample liquidTOSHIBA KK·Filed 2015·Granted Feb 20, 2018·0 cites·29 claims
- 4146US9770714B2Analysis package for detecting particles in a sample liquid, and including shield layersTOSHIBA KK·Filed 2015·Granted Sep 26, 2017·0 cites·16 claims
- 4246US2005264176A1Active matrix substrate, method of manufacturing active matrix substrate, and intermediate transfer substrate for manufacturing active matrix substrateONOZUKA YUTAKA·Filed 2005·Application pending·0 cites
- 4344US9885680B2Analysis package for detecting particles in a sample liquid including an analysis chip mounted on a package boardTOSHIBA KK·Filed 2015·Granted Feb 6, 2018·0 cites·14 claims
- 4444US2015021748A1Semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4542US2006172470A1Method of manufacturing thin film elementTOSHIBA KK·Filed 2006·Application pending·0 cites
- 4636US9397057B2Plurality of semiconductor devices in resin with a viaTOSHIBA KK·Filed 2015·Granted Jul 19, 2016·0 cites·20 claims
- 4733US2015348937A1Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2015·Application pending·0 cites
- 4833US2007057256A1Element forming substrate, active matrix substrate, and method of manufacturing the sameHARA YUJIRO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →