Inventor · disambiguated record
Yuzo Shimobeppu
Also filed as: SHIMOBEPPU YUZO
19 granted patents·4 pending applications·162 citations·filing 2000–2014
94Inventor score
Top patents by PatentIndex Score
23 records- 0192US7857140B2Semiconductor wafer storage case and semiconductor wafer storing methodFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Dec 28, 2010·20 cites·4 claims
- 0286US6837776B2Flat-object holder and method of using the sameFUJITSU LTD·Filed 2002·Granted Jan 4, 2005·35 cites·10 claims
- 0385US7479627B2Semiconductor device having transparent member and manufacturing method of the sameFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Jan 20, 2009·14 cites·11 claims
- 0485US7395847B2Jig for a semiconductor substrateFUJITSU LTD·Filed 2005·Granted Jul 8, 2008·9 cites·3 claims
- 0581US9010615B2Bonding apparatus and bonding methodFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Apr 21, 2015·3 cites·8 claims
- 0679US7820487B2Manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Oct 26, 2010·6 cites·17 claims
- 0778US6461942B2Semiconductor chip removing and conveying method and deviceFUJITSU LTD·Filed 2000·Granted Oct 8, 2002·24 cites·3 claims
- 0875US7432114B2Semiconductor device manufacturing methodFUJITSU LTD·Filed 2006·Granted Oct 7, 2008·6 cites·12 claims
- 0974US7109561B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2005·Granted Sep 19, 2006·4 cites·1 claims
- 1073US6750074B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2002·Granted Jun 15, 2004·13 cites·12 claims
- 1171US7571538B2Vacuum fixing jig for semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Aug 11, 2009·3 cites·1 claims
- 1268US6673654B2Method of manufacturing semiconductor device using heated conveyance memberFUJITSU LTD·Filed 2002·Granted Jan 6, 2004·15 cites·3 claims
- 1362US8016973B2Film bonding method, film bonding apparatus, and semiconductor device manufacturing methodFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Sep 13, 2011·2 cites·5 claims
- 1459US6902944B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2004·Granted Jun 7, 2005·5 cites·4 claims
- 1553US2011011919A1Bonding apparatus and bonding methodFUJITSU SEMICONDUCTOR LTD·Filed 2010·Application pending·0 cites
- 1652US2007215673A1Bonding apparatus and bonding methodFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1749US7563343B2Film lamination apparatus and method and a manufacturing method of a semiconductor apparatusFUJITSU MICROELECTRONICS LTD·Filed 2003·Granted Jul 21, 2009·2 cites·5 claims
- 1846US6951800B2Method of making semiconductor device that has improved structural strengthFUJITSU LTD·Filed 2002·Granted Oct 4, 2005·1 cites·1 claims
- 1943US2005085171A1Flat-object holder and method of using the sameFiled 2004·Application pending·0 cites
- 2042US7655505B2Manufacturing method of semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Feb 2, 2010·0 cites·5 claims
- 2139US8440545B2Method of manufacturing semiconductor device with spraying fluidFUKAYA HIRONORI·Filed 2008·Granted May 14, 2013·0 cites·14 claims
- 2235US2003073264A1Method of manufacturing semiconductor device from semiconductor wafer having thick peripheral portionFUJITSU LTD·Filed 2002·Application pending·0 cites
- 2326US8444799B2Method for manufacturing semiconductor device and surface protective tapeFUKAYA HIRONORI·Filed 2010·Granted May 21, 2013·0 cites·6 claims
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