Inventor · disambiguated record
Yu-Hsiang Sun
Also filed as: SUN YU-HSIANG
3 granted patents·2 pending applications·59 citations·filing 2011–2021
64Inventor score
Top patents by PatentIndex Score
5 records- 0192US9070793B2Semiconductor device packages having electromagnetic interference shielding and related methodsLIAO KUO-HSIEN·Filed 2011·Granted Jun 30, 2015·58 cites·20 claims
- 0279US11315858B1Chip package assembly with enhanced solder resist crack resistanceXILINX INC·Filed 2020·Granted Apr 26, 2022·1 cites·20 claims
- 0358US12009312B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 11, 2024·0 cites·17 claims
- 0449US2015140262A1Insulation layer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Application pending·0 cites
- 0540US2015271915A1Enhanced chip board package structureKINSUS INTERCONNECT TECH CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →