Inventor · disambiguated record
Yuichi Takada
Also filed as: TAKADA YUICHI
8 granted patents·2 pending applications·148 citations·filing 1975–2014
88Inventor score
Top patents by PatentIndex Score
10 records- 0194US7232513B1Electroplating bath containing wetting agent for defect reductionNOVELLUS SYSTEMS INC·Filed 2004·Granted Jun 19, 2007·51 cites·16 claims
- 0292US8172992B2Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2009·Granted May 8, 2012·21 cites·26 claims
- 0391US9677190B2Membrane design for reducing defects in electroplating systemsLAM RES CORP·Filed 2014·Granted Jun 13, 2017·7 cites·23 claims
- 0491US8197662B1Deposit morphology of electroplated copperWEBB ERIC·Filed 2010·Granted Jun 12, 2012·20 cites·20 claims
- 0584US7879218B1Deposit morphology of electroplated copperNOVELLUS SYSTEMS INC·Filed 2003·Granted Feb 1, 2011·28 cites·14 claims
- 0657US2012181170A1Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2012·Application pending·0 cites
- 0753US6963815B2Test support program and test support methodFUJITSU LTD·Filed 2004·Granted Nov 8, 2005·4 cites·12 claims
- 0850US5373495ADisk playback apparatusCHUO DENKI CO LTD·Filed 1993·Granted Dec 13, 1994·10 cites·17 claims
- 0939US4029591ALiquid detersive bleaching compositionLION FAT OIL CO LTD·Filed 1975·Granted Jun 14, 1977·7 cites·5 claims
- 1035US2003190773A1Method for manufacturing semiconductor device using shallow trench isolation processNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →