Inventor · disambiguated record
Yu-Han Tsai
Also filed as: TSAI YU-HAN
19 granted patents·2 pending applications·105 citations·filing 2009–2024
93Inventor score
Top patents by PatentIndex Score
21 records- 0194US8916471B1Method for forming semiconductor structure having through silicon via for signal and shielding structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 23, 2014·35 cites·19 claims
- 0293US12154852B2Interconnection structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 26, 2024·2 cites·9 claims
- 0388US8373984B2Docking station for connecting a notebook computerWISTRON CORP·Filed 2011·Granted Feb 12, 2013·13 cites·16 claims
- 0487US11127675B2Interconnection structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 21, 2021·5 cites·20 claims
- 0587US8518823B2Through silicon via and method of forming the sameHUANG KUO-HSIUNG·Filed 2011·Granted Aug 27, 2013·14 cites·5 claims
- 0683US8943649B2Hinge and foldable electronic apparatus therewithWISTRON CORP·Filed 2013·Granted Feb 3, 2015·16 cites·20 claims
- 0781US10600732B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 24, 2020·3 cites·20 claims
- 0881US8841755B2Through silicon via and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 23, 2014·5 cites·10 claims
- 0975US12506067B2Interconnection structureUNITED MICROELECTRONICS CORP·Filed 2024·Granted Dec 23, 2025·0 cites·10 claims
- 1073US9042104B2Portable electronic device and electronic module fixing structure thereofTSAI YU-HAN·Filed 2012·Granted May 26, 2015·5 cites·32 claims
- 1168US8900996B2Through silicon via structure and method of fabricating the sameCHEN HSIN-YU·Filed 2012·Granted Dec 2, 2014·2 cites·10 claims
- 1264US9312208B2Through silicon via structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 12, 2016·1 cites·4 claims
- 1361US10520995B2Portable electronic module and heat dissipating mechanism thereofWISTRON CORP·Filed 2013·Granted Dec 31, 2019·2 cites·12 claims
- 1459US8339793B2Electronic device with a motherboard waterproofing mechanismTSAI YU-HAN·Filed 2009·Granted Dec 25, 2012·2 cites·11 claims
- 1556US11912006B2Continuous manufacturing equipment of elastic three-dimensional fabric and continuous manufacturing method thereofTAIWAN TEXTILE FEDERATION R O C·Filed 2022·Granted Feb 27, 2024·0 cites·5 claims
- 1655US11646264B2Semiconductor structure with super via and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted May 9, 2023·0 cites·17 claims
- 1744US8691688B2Method of manufacturing semiconductor structureCHEN HSIN-YU·Filed 2012·Granted Apr 8, 2014·0 cites·17 claims
- 1844US8218298B2Door mechanism with a retractable function and related electronic deviceTSAI YU-HAN·Filed 2010·Granted Jul 10, 2012·0 cites·20 claims
- 1942US8116074B2Removable mechanism for drawing an object and removable device thereofTSAI YU-HAN·Filed 2010·Granted Feb 14, 2012·0 cites·17 claims
- 2041US2014368034A1Power supply system and method and electronic device thereofWISTRON CORP·Filed 2013·Application pending·0 cites
- 2139US2013270712A1Through silicon via structure and method of fabricating the sameCHEN HSIN-YU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →