Inventor · disambiguated record
Yu-Ling Tsai
Also filed as: TSAI YU LING
14 granted patents·4 pending applications·12 citations·filing 2010–2025
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9MULTISTARS BIOTECHNOLOGY COMPANY LTD3NXP BV3LIN TSUNG-SHU1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
18 records- 0189US10665520B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·4 cites·20 claims
- 0286US12354924B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0386US11147843B2Method of preventing or treating obesity using a novel strain of Parabacteroides goldsteiniiMULTISTARS BIOTECHNOLOGY COMPANY LTD·Filed 2019·Granted Oct 19, 2021·3 cites·13 claims
- 0482US11984375B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 0580US9064881B2Protecting flip-chip package using pre-applied filletTSAI TSUNG-FU·Filed 2010·Granted Jun 23, 2015·4 cites·20 claims
- 0678US12125757B2Semiconductor package with stiffener structure and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0778US2025357367A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0876US11658085B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 23, 2023·0 cites·20 claims
- 0971US11217497B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·20 claims
- 1070US11721602B2Semiconductor package with stiffener structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 1163US11235009B2Method of ameliorating chronic kidney disease using Parabacteroides goldsteiniiMULTISTARS BIOTECHNOLOGY COMPANY LTD·Filed 2019·Granted Feb 1, 2022·0 cites·15 claims
- 1259US8373282B2Wafer level chip scale package with reduced stress on solder ballsTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 12, 2013·1 cites·19 claims
- 1354US2025157862A1Semiconductor device having integrated lid structure and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 1454US2025157986A1Die in die semiconductor device and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 1552US11116803B2Method of treating lung cancer using Parabacteroides goldsteiniiMULTISTARS BIOTECHNOLOGY COMPANY LTD·Filed 2019·Granted Sep 14, 2021·0 cites·12 claims
- 1651US9620414B2Protecting flip-chip package using pre-applied filletTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·0 cites·19 claims
- 1746US2025006598A1Semiconductor device with leadframe spacer and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 1838US8927333B2Die carrier for package on package assemblyLIN TSUNG-SHU·Filed 2011·Granted Jan 6, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →