Inventor · disambiguated record
Yuan-Ping Tseng
Also filed as: TSENG YUAN-PING
11 granted patents·4 pending applications·298 citations·filing 2001–2003
91Inventor score
Top patents by PatentIndex Score
15 records- 0195US6534853B2Semiconductor wafer designed to avoid probed marks while testingCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted Mar 18, 2003·141 cites·14 claims
- 0288US6853205B1Probe card assemblyCHIPMOS TECHNOLOGIES BERMUDA·Filed 2003·Granted Feb 8, 2005·41 cites·9 claims
- 0379US6686615B1Flip-chip type semiconductor device for reducing signal skewCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Feb 3, 2004·35 cites·5 claims
- 0479US6621710B1Modular probe card assemblyCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Sep 16, 2003·29 cites·1 claims
- 0573US6395622B1Manufacturing process of semiconductor devicesCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted May 28, 2002·16 cites·6 claims
- 0665US6781392B1Modularized probe card with compressible electrical connection deviceCHIPMOS TECHNOLOGIES LTD·Filed 2003·Granted Aug 24, 2004·14 cites·18 claims
- 0764US6812720B1Modularized probe card with coaxial transmittersCHIPMOS TECHNOLOGIES BERMUDA·Filed 2003·Granted Nov 2, 2004·11 cites·11 claims
- 0852US7140101B2Method for fabricating anisotropic conductive substrateCHIPMOS TECHNOLOGIES INC·Filed 2003·Granted Nov 28, 2006·4 cites·10 claims
- 0948US6605480B2Wafer level packaging for making flip-chipsCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted Aug 12, 2003·4 cites·8 claims
- 1042US7005054B2Method for manufacturing probes of a probe cardCHIPMOS TECHNOLOGIES INC·Filed 2002·Granted Feb 28, 2006·0 cites·6 claims
- 1137US6751760B2Method and system for performing memory repair analysisCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted Jun 15, 2004·3 cites·8 claims
- 1233US2005070049A1Method for fabricating wafer-level chip scale packagesFiled 2003·Application pending·0 cites
- 1332US2004012405A1Probe card with full wafer contact configurationCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Application pending·0 cites
- 1428US2005014308A1Manufacturing process of memory module with direct die-attachmentFiled 2003·Application pending·0 cites
- 1526US2003101388A1System and method for avoiding waiting repair analysis for semiconductor testing equipmentCHIPMOS TECHNOLOGIES INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →