Inventor · disambiguated record
Yuchun Wang
Also filed as: WANG YUCHUN · WANG YUCHUN EUGENE
36 granted patents·14 pending applications·863 citations·filing 1999–2025
98Inventor score
Files withAPPLIED MATERIALS INC23CABOT MICROELECTRONICS CORP4XU KUN4ASM NUTOOL INC3CONTEMPORARY AMPEREX TECHNOLOGY CO LTD2
Top patents by PatentIndex Score
50 records- 0197US6537144B1Method and apparatus for enhanced CMP using metals having reductive propertiesAPPLIED MATERIALS INC·Filed 2000·Granted Mar 25, 2003·145 cites·32 claims
- 0296US6899804B2Electrolyte composition and treatment for electrolytic chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted May 31, 2005·77 cites·37 claims
- 0395US8221193B2Closed loop control of pad profile based on metrology feedbackCHANG SHOU-SUNG·Filed 2008·Granted Jul 17, 2012·29 cites·20 claims
- 0495US6569349B1Additives to CMP slurry to polish dielectric filmsAPPLIED MATERIALS INC·Filed 2000·Granted May 27, 2003·92 cites·5 claims
- 0594US6561873B2Method and apparatus for enhanced CMP using metals having reductive propertiesAPPLIED MATERIALS INC·Filed 2002·Granted May 13, 2003·66 cites·54 claims
- 0692US6908374B2Chemical mechanical polishing endpoint detectionNUTOOL INC·Filed 2002·Granted Jun 21, 2005·43 cites·29 claims
- 0791US6857947B2Advanced chemical mechanical polishing system with smart endpoint detectionASM NUTOOL INC·Filed 2003·Granted Feb 22, 2005·43 cites·49 claims
- 0890US6988942B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 24, 2006·41 cites·18 claims
- 0989US6638143B2Ion exchange materials for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Oct 28, 2003·41 cites·18 claims
- 1086US7066800B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jun 27, 2006·31 cites·67 claims
- 1183US7091604B2Three dimensional integrated circuitsCABOT MICROELECTRONICS CORP·Filed 2004·Granted Aug 15, 2006·35 cites·20 claims
- 1283US6520840B1CMP slurry for planarizing metalsAPPLIED MATERIALS INC·Filed 2000·Granted Feb 18, 2003·25 cites·55 claims
- 1382US7137879B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 21, 2006·7 cites·20 claims
- 1481US6942546B2Endpoint detection for non-transparent polishing memberASM NUTOOL INC·Filed 2002·Granted Sep 13, 2005·23 cites·20 claims
- 1581US6572453B1Multi-fluid polishing processAPPLIED MATERIALS INC·Filed 2000·Granted Jun 3, 2003·25 cites·20 claims
- 1679US6783432B2Additives for pressure sensitive polishing compositionsAPPLIED MATERIALS INC·Filed 2001·Granted Aug 31, 2004·19 cites·20 claims
- 1777US6265026B1Vapor phase depositionUNIV CALIFORNIA·Filed 1999·Granted Jul 24, 2001·31 cites·3 claims
- 1876US6657726B1In situ measurement of slurry distributionAPPLIED MATERIALS INC·Filed 2000·Granted Dec 2, 2003·20 cites·18 claims
- 1975US6435944B1CMP slurry for planarizing metalsAPPLIED MATERIALS INC·Filed 1999·Granted Aug 20, 2002·23 cites·44 claims
- 2074US6872329B2Chemical mechanical polishing composition and processAPPLIED MATERIALS INC·Filed 2001·Granted Mar 29, 2005·15 cites·32 claims
- 2174US2025385311A1Electrolytic solution, secondary battery and electric deviceCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 2272US2025364602A1Electrolyte solution, secondary battery and electrical apparatusCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 2371US8012000B2Extended pad life for ECMP and barrier removalAPPLIED MATERIALS INC·Filed 2007·Granted Sep 6, 2011·2 cites·20 claims
- 2471US7454292B2Inverse-vector method for smoothing dips and azimuthsSAUDI ARABIAN OIL CO·Filed 2007·Granted Nov 18, 2008·11 cites·14 claims
- 2566US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 2664US9496190B2Feedback of layer thickness timing and clearance timing for polishing controlAPPLIED MATERIALS INC·Filed 2015·Granted Nov 15, 2016·1 cites·21 claims
- 2764US8586481B2Chemical planarization of copper wafer polishingWANG YOU·Filed 2011·Granted Nov 19, 2013·2 cites·8 claims
- 2863US8989890B2GST film thickness monitoringXU KUN·Filed 2010·Granted Mar 24, 2015·1 cites·17 claims
- 2962US9073169B2Feedback control of polishing using optical detection of clearanceXU KUN·Filed 2011·Granted Jul 7, 2015·2 cites·26 claims
- 3060US7311592B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Dec 25, 2007·1 cites·17 claims
- 3159US8639377B2Metrology for GST film thickness and phaseXU KUN·Filed 2008·Granted Jan 28, 2014·1 cites·32 claims
- 3258US7653258B2Enhanced isotropic 2D and 3D gradient methodSAUDI ARABIAN OIL CO·Filed 2007·Granted Jan 26, 2010·2 cites·14 claims
- 3356US2010130013A1Slurry composition for gst phase change memory materials polishingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 3454US8855440B2Structure-independent analysis of 3-D seismic random noiseAL-DOSSARY SALEH·Filed 2008·Granted Oct 7, 2014·1 cites·2 claims
- 3554US8170288B2Reducing noise in 3D seismic data while preserving structural detailsWANG YUCHUN EUGENE·Filed 2009·Granted May 1, 2012·5 cites·5 claims
- 3648US2010096360A1Compositions and methods for barrier layer polishingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 3748US2010130101A1Two-line mixing of chemical and abrasive particles with endpoint control for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 3845US2008293343A1Pad with shallow cells for electrochemical mechanical processingWANG YUCHUN·Filed 2007·Application pending·0 cites
- 3943US7955519B2Composition and method for planarizing surfacesCABOT MICROELECTRONICS CORP·Filed 2005·Granted Jun 7, 2011·0 cites·24 claims
- 4043US2007218587A1Soft conductive polymer processing pad and method for fabricating the sameAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4142US8210900B2Dishing and defect control of chemical mechanical polishing using real-time adjustable additive deliveryTU WEN-CHIANG·Filed 2008·Granted Jul 3, 2012·0 cites·14 claims
- 4239US6984587B2Integrated polishing and electroless depositionCABOT MICROELECTRONICS CORP·Filed 2004·Granted Jan 10, 2006·0 cites·27 claims
- 4339US2006278614A1Polishing composition and method for defect improvement by reduced particle stiction on copper surfaceCABOT MICROELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 4438US2011189856A1High Sensitivity Real Time Profile Control Eddy Current Monitoring SystemXU KUN·Filed 2011·Application pending·0 cites
- 4538US2013186850A1Slurry for cobalt applicationsWANG YOU·Filed 2012·Application pending·0 cites
- 4637US2004023607A1Method and apparatus for integrated chemical mechanical polishing of copper and barrier layersFiled 2003·Application pending·0 cites
- 4737US2011189925A1High Sensitivity Real Time Profile Control Eddy Current Monitoring SystemIRAVANI HASSAN G·Filed 2011·Application pending·0 cites
- 4837US2002006767A1Ion exchange pad or brush and method of regenerating the sameAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 4936US2004014399A1Selective barrier removal slurryFiled 2002·Application pending·0 cites
- 5035US6926589B2Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishingASM NUTOOL INC·Filed 2002·Granted Aug 9, 2005·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →