Inventor · disambiguated record
Zavier Zai Yeong Tan
Also filed as: TAN ZAVIER · TAN ZAVIER ZAI YEONG
3 granted patents·3 pending applications·0 citations·filing 2019–2023
44Inventor score
Technology areasH10P
Files withAPPLIED MATERIALS INC6
Top patents by PatentIndex Score
6 records- 0171US2024079273A1Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approachAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0263US11854888B2Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approachAPPLIED MATERIALS INC·Filed 2020·Granted Dec 26, 2023·0 cites·7 claims
- 0358US2021233816A1Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 0457US11011424B2Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2019·Granted May 18, 2021·0 cites·14 claims
- 0550US11901232B2Automatic kerf offset mapping and correction system for laser dicingAPPLIED MATERIALS INC·Filed 2020·Granted Feb 13, 2024·0 cites·10 claims
- 0648US2024363412A1Hybrid wafer dicing approach using a rectangular laser spot-based laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →