Inventor · disambiguated record
Zhian He
Also filed as: HE ZHIAN
36 granted patents·6 pending applications·409 citations·filing 2006–2024
97Inventor score
Files withLAM RES CORP19NOVELLUS SYSTEMS INC8MAYER STEVEN3SHENZHEN EVERWIN PRECISION TECH CO LTD3BUCKALEW BRYAN2
Top patents by PatentIndex Score
42 records- 0198US8262871B1Plating method and apparatus with multiple internally irrigated chambersMAYER STEVEN T·Filed 2009·Granted Sep 11, 2012·55 cites·21 claims
- 0297US8377268B2Electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2011·Granted Feb 19, 2013·19 cites·23 claims
- 0397US7985325B2Closed contact electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 26, 2011·36 cites·24 claims
- 0496US9481942B2Geometry and process optimization for ultra-high RPM platingLAM RES CORP·Filed 2015·Granted Nov 1, 2016·9 cites·26 claims
- 0596US8128791B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2006·Granted Mar 6, 2012·39 cites·24 claims
- 0695US9309604B2Method and apparatus for electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 12, 2016·18 cites·20 claims
- 0795US8475644B2Method and apparatus for electroplatingMAYER STEVEN·Filed 2009·Granted Jul 2, 2013·36 cites·20 claims
- 0894US11401623B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2021·Granted Aug 2, 2022·3 cites·26 claims
- 0994US9045841B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2012·Granted Jun 2, 2015·9 cites·19 claims
- 1094US8475636B2Method and apparatus for electroplatingMAYER STEVEN·Filed 2009·Granted Jul 2, 2013·30 cites·19 claims
- 1193US11859300B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2022·Granted Jan 2, 2024·2 cites·18 claims
- 1293US8475637B2Electroplating apparatus with vented electrolyte manifoldFENG JINGBIN·Filed 2008·Granted Jul 2, 2013·14 cites·24 claims
- 1393US8308931B2Method and apparatus for electroplatingREID JONATHAN·Filed 2008·Granted Nov 13, 2012·62 cites·34 claims
- 1492US9816194B2Control of electrolyte flow dynamics for uniform electroplatingLAM RES CORP·Filed 2015·Granted Nov 14, 2017·8 cites·14 claims
- 1592US8172992B2Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2009·Granted May 8, 2012·21 cites·26 claims
- 1691US9670588B2Anisotropic high resistance ionic current source (AHRICS)LAM RES CORP·Filed 2014·Granted Jun 6, 2017·10 cites·18 claims
- 1788US10023970B2Dynamic current distribution control apparatus and method for wafer electroplatingNOVELLUS SYSTEMS INC·Filed 2017·Granted Jul 17, 2018·4 cites·17 claims
- 1888US9909228B2Method and apparatus for dynamic current distribution control during electroplatingLAM RES CORP·Filed 2013·Granted Mar 6, 2018·3 cites·16 claims
- 1987US10927475B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2018·Granted Feb 23, 2021·4 cites·16 claims
- 2087US10011917B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2015·Granted Jul 3, 2018·5 cites·11 claims
- 2185US10214828B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2018·Granted Feb 26, 2019·3 cites·8 claims
- 2285US10214829B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2018·Granted Feb 26, 2019·3 cites·16 claims
- 2384US9028657B2Front referenced anodeFENG JINGBIN·Filed 2010·Granted May 12, 2015·5 cites·13 claims
- 2481US12392049B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 2581US9822461B2Dynamic current distribution control apparatus and method for wafer electroplatingNOVELLUS SYSTEMS INC·Filed 2012·Granted Nov 21, 2017·4 cites·30 claims
- 2680US9340893B2Front referenced anodeNOVELLUS SYSTEMS INC·Filed 2015·Granted May 17, 2016·2 cites·14 claims
- 2778US8540857B1Plating method and apparatus with multiple internally irrigated chambersMAYER STEVEN·Filed 2012·Granted Sep 24, 2013·1 cites·22 claims
- 2878US2025122639A1Electrochemical deposition system including optical probesLAM RES CORP·Filed 2024·Application pending·0 cites
- 2974US10689774B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2019·Granted Jun 23, 2020·1 cites·13 claims
- 3072US10301739B2Anisotropic high resistance ionic current source (AHRICS)LAM RES CORP·Filed 2017·Granted May 28, 2019·1 cites·20 claims
- 3172US9512538B2Plating cup with contoured cup bottomHE ZHIAN·Filed 2012·Granted Dec 6, 2016·1 cites·16 claims
- 3271US10351968B2Front referenced anodeNOVELLUS SYSTEMS INC·Filed 2016·Granted Jul 16, 2019·1 cites·24 claims
- 3367US2023092179A1Heater assembly and cartridgeSHENZHEN EVERWIN PRECISION TECH CO LTD·Filed 2022·Application pending·0 cites
- 3465US2018142374A1Method and apparatus for dynamic current distribution control during electroplatingLAM RES CORP·Filed 2018·Application pending·0 cites
- 3562US10053792B2Plating cup with contoured cup bottomNOVELLUS SYSTEMS INC·Filed 2016·Granted Aug 21, 2018·0 cites·6 claims
- 3661US12180607B2Electrochemical deposition system including optical probesLAM RES CORP·Filed 2020·Granted Dec 31, 2024·0 cites·19 claims
- 3759US2023087448A1Atomizing core and cartridgeSHENZHEN EVERWIN PRECISION TECH CO LTD·Filed 2022·Application pending·0 cites
- 3857US2012181170A1Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2012·Application pending·0 cites
- 3956US2023313408A1Plating-deplating waveform based contact cleaning for a substrate electroplating systemLAM RES CORP·Filed 2021·Application pending·0 cites
- 4055US11225727B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2020·Granted Jan 18, 2022·0 cites·8 claims
- 4153US12219993B2Closure body and cartridgeSHENZHEN EVERWIN PRECISION TECH CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·15 claims
- 4242US10358738B2Gap fill process stability monitoring of an electroplating process using a potential-controlled exit stepLAM RES CORP·Filed 2016·Granted Jul 23, 2019·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →