Inventor · disambiguated record
Zhong-Xiang He
Also filed as: HE ZHONG X · HE ZHONG-XIANG
161 granted patents·19 pending applications·1,199 citations·filing 1999–2024
99Inventor score
Top patents by PatentIndex Score
180 records- 0199US8519892B2Integrated millimeter wave antenna and transceiver on a substrateDING HANYI·Filed 2012·Granted Aug 27, 2013·197 cites·19 claims
- 0297US10211146B2Air gap over transistor gate and related methodGLOBALFOUNDRIES INC·Filed 2016·Granted Feb 19, 2019·24 cites·18 claims
- 0397US8865497B2Planar cavity MEMS and related structures, methods of manufacture and design structuresDUNBAR III GEORGE A·Filed 2010·Granted Oct 21, 2014·27 cites·27 claims
- 0497US7781781B2CMOS imager array with recessed dielectricIBM·Filed 2006·Granted Aug 24, 2010·65 cites·11 claims
- 0596US7323948B2Vertical LC tank deviceIBM·Filed 2005·Granted Jan 29, 2008·43 cites·8 claims
- 0695US10157777B2Air gap over transistor gate and related methodGLOBALFOUNDRIES INC·Filed 2016·Granted Dec 18, 2018·13 cites·19 claims
- 0795US8847401B2Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structureIBM·Filed 2012·Granted Sep 30, 2014·22 cites·25 claims
- 0895US8674423B2Semiconductor structure having vias and high density capacitorsCOLLINS DAVID S·Filed 2011·Granted Mar 18, 2014·26 cites·18 claims
- 0995US8604618B2Structure and method for reducing vertical crack propagationCOONEY III EDWARD C·Filed 2011·Granted Dec 10, 2013·24 cites·21 claims
- 1094US10062748B1Segmented guard-ring and chip edge sealsGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 28, 2018·10 cites·18 claims
- 1194US8563336B2Method for forming thin film resistor and terminal bond pad simultaneouslyCHEN FEN·Filed 2008·Granted Oct 22, 2013·18 cites·16 claims
- 1294US7768055B2Passive components in the back end of integrated circuitsIBM·Filed 2005·Granted Aug 3, 2010·28 cites·7 claims
- 1393US7564319B2Vertical LC tank deviceIBM·Filed 2007·Granted Jul 21, 2009·24 cites·21 claims
- 1492US7361993B2Terminal pad structures and methods of fabricating sameIBM·Filed 2005·Granted Apr 22, 2008·21 cites·14 claims
- 1591US9355972B2Method for making a dielectric region in a bulk silicon substrate providing a high-Q passive resonatorIBM·Filed 2014·Granted May 31, 2016·8 cites·20 claims
- 1691US7902629B2Integrated BEOL thin film resistorIBM·Filed 2008·Granted Mar 8, 2011·16 cites·8 claims
- 1791US7750408B2Integrated circuit structure incorporating an inductor, a conductive sheet and a protection circuitIBM·Filed 2007·Granted Jul 6, 2010·19 cites·21 claims
- 1890US8299475B2Interlevel conductive light shieldGAMBINO JEFFREY P·Filed 2012·Granted Oct 30, 2012·5 cites·13 claims
- 1990US7361950B2Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectricIBM·Filed 2005·Granted Apr 22, 2008·17 cites·17 claims
- 2088US9620371B2Semiconductor structures having low resistance paths throughout a waferIBM·Filed 2015·Granted Apr 11, 2017·3 cites·12 claims
- 2188US8375539B2Method of manufacturing complimentary metal-insulator-metal (MIM) capacitorsIBM·Filed 2009·Granted Feb 19, 2013·13 cites·13 claims
- 2288US7271693B2On-chip inductor with magnetic coreIBM·Filed 2006·Granted Sep 18, 2007·13 cites·6 claims
- 2388US7071530B1Multiple layer structure for substrate noise isolationIBM·Filed 2005·Granted Jul 4, 2006·18 cites·20 claims
- 2487US10910304B2Tight pitch wirings and capacitor(s)GLOBALFOUNDRIES INC·Filed 2019·Granted Feb 2, 2021·6 cites·20 claims
- 2587US8158988B2Interlevel conductive light shieldGAMBINO JEFFREY P·Filed 2008·Granted Apr 17, 2012·8 cites·13 claims
- 2687US8159040B2Metal gate integration structure and method including metal fuse, anti-fuse and/or resistorCOOLBAUGH DOUGLAS D·Filed 2008·Granted Apr 17, 2012·15 cites·21 claims
- 2787US7645675B2Integrated parallel plate capacitorsIBM·Filed 2006·Granted Jan 12, 2010·16 cites·2 claims
- 2887US7485540B2Integrated BEOL thin film resistorIBM·Filed 2005·Granted Feb 3, 2009·11 cites·14 claims
- 2986US9406472B2Planar cavity MEMS and related structures, methods of manufacture and design structuresDANG DINH·Filed 2010·Granted Aug 2, 2016·2 cites·19 claims
- 3086US8421183B2Structure of very high insertion loss of the substrate noise decouplingDING HANYI·Filed 2011·Granted Apr 16, 2013·6 cites·14 claims
- 3186US8232920B2Integrated millimeter wave antenna and transceiver on a substrateDING HANYI·Filed 2008·Granted Jul 31, 2012·15 cites·17 claims
- 3286US7943404B2Integrated millimeter wave antenna and transceiver on a substrateIBM·Filed 2008·Granted May 17, 2011·17 cites·18 claims
- 3386US7410894B2Post last wiring level inductor using patterned plate processIBM·Filed 2005·Granted Aug 12, 2008·9 cites·8 claims
- 3485US9252080B1Dielectric cover for a through silicon viaGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 2, 2016·7 cites·11 claims
- 3585US9159671B2Copper wire and dielectric with air gapsIBM·Filed 2013·Granted Oct 13, 2015·5 cites·16 claims
- 3685US8191217B2Complimentary metal-insulator-metal (MIM) capacitors and method of manufactureDUNN JAMES S·Filed 2009·Granted Jun 5, 2012·11 cites·8 claims
- 3785US6876028B1Metal-insulator-metal capacitor and method of fabricationIBM·Filed 2003·Granted Apr 5, 2005·34 cites·19 claims
- 3884US8378450B2Interdigitated vertical parallel capacitorIBM·Filed 2009·Granted Feb 19, 2013·12 cites·25 claims
- 3984US7494912B2Terminal pad structures and methods of fabricating sameIBM·Filed 2007·Granted Feb 24, 2009·9 cites·8 claims
- 4083US8901710B2Interdigitated capacitors with a zero quadratic voltage coefficient of capacitance or zero linear temperature coefficient of capacitanceIBM·Filed 2013·Granted Dec 2, 2014·7 cites·20 claims
- 4183US8298902B2Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuitDALTON TIMOTHY J·Filed 2009·Granted Oct 30, 2012·11 cites·21 claims
- 4283US8093679B2Integrated BEOL thin film resistorCHINTHAKINDI ANIL K·Filed 2011·Granted Jan 10, 2012·5 cites·8 claims
- 4383US8039354B2Passive components in the back end of integrated circuitsIBM·Filed 2010·Granted Oct 18, 2011·6 cites·5 claims
- 4483US7763954B2Post last wiring level inductor using patterned plate processIBM·Filed 2008·Granted Jul 27, 2010·7 cites·10 claims
- 4583US7573117B2Post last wiring level inductor using patterned plate processIBM·Filed 2008·Granted Aug 11, 2009·7 cites·8 claims
- 4682US8575022B2Top corner rounding of damascene wire for insulator crack suppressionCHRISMAN GREGORY S·Filed 2011·Granted Nov 5, 2013·9 cites·22 claims
- 4782US8399927B2Semiconductor structure including a high performance fet and a high voltage fet on an SOI substrateDING HANYI·Filed 2012·Granted Mar 19, 2013·5 cites·12 claims
- 4882US7759243B2Method for forming an on-chip high frequency electro-static discharge deviceIBM·Filed 2008·Granted Jul 20, 2010·10 cites·20 claims
- 4982US7061359B2On-chip inductor with magnetic coreIBM·Filed 2003·Granted Jun 13, 2006·27 cites·9 claims
- 5081US8171435B2Integrated circuit structure incorporating an inductor, an associated design method and an associated design systemHE ZHONG-XIANG·Filed 2010·Granted May 1, 2012·5 cites·20 claims
Showing the top 50 of 180 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →