Inventor · disambiguated record
Zhongming Liu
Also filed as: LIU ZHONGMING
29 granted patents·10 pending applications·201 citations·filing 2007–2025
92Inventor score
Top patents by PatentIndex Score
39 records- 0197US7841986B2Methods and apparatus of three dimensional cardiac electrophysiological imagingUNIV MINNESOTA·Filed 2007·Granted Nov 30, 2010·195 cites·26 claims
- 0285US11264249B2Carbon containing hardmask removal process using sulfur containing process gasMATTSON TECH INC·Filed 2019·Granted Mar 1, 2022·4 cites·18 claims
- 0384US12009223B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jun 11, 2024·1 cites·12 claims
- 0480US12362192B2Method for manufacturing semiconductor structure, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 15, 2025·1 cites·16 claims
- 0568US2025311200A1Semiconductor structure, semiconductor device, and method for manufacturing semiconductor structureCXMT CORP·Filed 2024·Application pending·0 cites
- 0661US2025071977A1Semiconductor structure and method for fabricating sameCXMT CORP·Filed 2024·Application pending·0 cites
- 0760US12408327B2Semiconductor structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2023·Granted Sep 2, 2025·0 cites·16 claims
- 0860US2025338481A1Memory device, and semiconductor structure and method for manufacturing sameCXMT CORP·Filed 2025·Application pending·0 cites
- 0959US12495536B2Semiconductor structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 9, 2025·0 cites·12 claims
- 1058US12453081B2Method of forming a bit line structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 21, 2025·0 cites·8 claims
- 1158US12108593B2Method for preparing semiconductor structure using a first mask comprises a grooveCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 1, 2024·0 cites·12 claims
- 1257US12501609B2Memory device and method for manufacturing memory deviceCHANGXIN MEMORY TECH INC·Filed 2023·Granted Dec 16, 2025·0 cites·17 claims
- 1356US12363882B2Method of manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 15, 2025·0 cites·7 claims
- 1456US12347685B2Semiconductor structure and method for fabricating sameCHANGXIN MEMORY TECH INC·Filed 2023·Granted Jul 1, 2025·0 cites·16 claims
- 1555US12150294B2Method for manufacturing semiconductor structure and sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Nov 19, 2024·0 cites·18 claims
- 1655US12100593B2Method for forming self-aligned double pattern and semiconductor structuresCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 24, 2024·0 cites·15 claims
- 1755US11956946B2Method for forming a semiconductor memory structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Apr 9, 2024·0 cites·13 claims
- 1854US2023116155A1Semiconductor structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 1953US12369308B2Memory device, and semiconductor structure and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 22, 2025·0 cites·16 claims
- 2053US12341010B2Preparation method for semiconductor structure and sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 24, 2025·0 cites·17 claims
- 2153US12213305B2Manufacturing method of semiconductor structure with epitaxial layer forming extension portionCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 28, 2025·0 cites·14 claims
- 2253US12160987B2Method for fabricating memory and memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 3, 2024·0 cites·15 claims
- 2353US12100657B2Semiconductor device and method for forming semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 24, 2024·0 cites·14 claims
- 2453US12089398B2Method for manufacturing memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 10, 2024·0 cites·17 claims
- 2552US12193209B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 7, 2025·0 cites·11 claims
- 2652US12185519B2Memory device capacitor contact structure and method for preparing sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 31, 2024·0 cites·16 claims
- 2752US12119226B2Method for manufacturing mask structure, semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 15, 2024·0 cites·8 claims
- 2852US11984398B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted May 14, 2024·0 cites·15 claims
- 2952US11930635B2Semiconductor structure and method of manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Mar 12, 2024·0 cites·11 claims
- 3052US2023164983A1Method for preparing semiconductor structure, semiconductor structure and semiconductor memoryCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 3151US12165879B2Method for manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Dec 10, 2024·0 cites·13 claims
- 3250US12106817B2Method for manufacturing a memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 3350US11942522B2Method for manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Mar 26, 2024·0 cites·16 claims
- 3448US2022216214A1Semiconductor structure manufacturing method and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 3547US12068160B2Method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Aug 20, 2024·0 cites·19 claims
- 3646US2022302125A1Semiconductor memory and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 3745US2023016088A1Semiconductor structure and fabrication method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 3845US2022310626A1Method for fabricating semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 3941US2018055406A1Electrophysiological Measurement and Stimulation within MRI BoreMANDAL RANAJAY·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →