Inventor · disambiguated record
Zhong Lu
Also filed as: LU ZHONG · LU ZHONG PING
8 granted patents·8 pending applications·122 citations·filing 1993–2017
87Inventor score
Files withSANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD4SANDISK SEMICONDUCTOR SHANGHAI CO LTD3GU WEI2FU PENG1LIAO CHIH-CHIN1
Top patents by PatentIndex Score
16 records- 0184US9240393B2High yield semiconductor deviceSANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2014·Granted Jan 19, 2016·9 cites·25 claims
- 0283US9773766B2Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2013·Granted Sep 26, 2017·8 cites·20 claims
- 0382US9704797B2Waterfall wire bondingLU ZHONG·Filed 2011·Granted Jul 11, 2017·11 cites·11 claims
- 0478US9230942B2Semiconductor device including alternating stepped semiconductor die stacksSANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2013·Granted Jan 5, 2016·6 cites·20 claims
- 0570US5369453AMethod and eyeglasses for rectifying color blindnessFiled 1993·Granted Nov 29, 1994·46 cites·15 claims
- 0669US9337153B2EMI shielding and thermal dissipation for semiconductor deviceFU PENG·Filed 2011·Granted May 10, 2016·4 cites·21 claims
- 0768US9331045B2Semiconductor die laminating device with independent drivesGU WEI·Filed 2012·Granted May 3, 2016·3 cites·20 claims
- 0863US6142626AChromatic vision correction resin glasses with reduced concave reflectionUSTC UNIV SCIENCE TECH CN·Filed 1999·Granted Nov 7, 2000·35 cites·3 claims
- 0959US2010024909A1Adjustable rod structureLU ZHONG PING·Filed 2009·Application pending·0 cites
- 1048US2015155247A1Bridge structure for embedding semiconductor dieSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2014·Application pending·0 cites
- 1147US2017179101A1Bridge structure for embedding semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2017·Application pending·0 cites
- 1245US2012279651A1Epoxy coating on substrate for die attachGU WEI·Filed 2011·Application pending·0 cites
- 1343US2014346686A1Methods for forming color images on memory devices and memory devices formed therebyPENG FU·Filed 2011·Application pending·0 cites
- 1443US2015214184A1Epoxy coating on substrate for die attachSANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2015·Application pending·0 cites
- 1543US2016086827A1Methods for forming color images on memory devices and memory devices formed therebySANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2015·Application pending·0 cites
- 1635US2013015589A1Chip-on-package structure for multiple die stacksLIAO CHIH-CHIN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →