Inventor · disambiguated record
Zhize Zhu
Also filed as: ZHU ZHIZE
10 granted patents·11 pending applications·92 citations·filing 2004–2025
88Inventor score
Top patents by PatentIndex Score
21 records- 0195US11931853B2Control of processing parameters for substrate polishing with angularly distributed zones using cost functionAPPLIED MATERIALS INC·Filed 2022·Granted Mar 19, 2024·2 cites·19 claims
- 0295US7514353B2Contact metallization scheme using a barrier layer over a silicide layerAPPLIED MATERIALS INC·Filed 2006·Granted Apr 7, 2009·37 cites·33 claims
- 0394US8039397B2Using optical metrology for within wafer feed forward process controlAPPLIED MATERIALS INC·Filed 2009·Granted Oct 18, 2011·20 cites·24 claims
- 0493US8292693B2Using optical metrology for wafer to wafer feed back process controlDAVID JEFFREY DRUE·Filed 2009·Granted Oct 23, 2012·16 cites·24 claims
- 0589US8814631B2Tracking spectrum features in two dimensions for endpoint detectionDAVID JEFFREY DRUE·Filed 2011·Granted Aug 26, 2014·13 cites·15 claims
- 0684US2025319568A1Control of processing parameters for substrate polishing with substrate precessionAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0780US8679979B2Using optical metrology for within wafer feed forward process controlDAVID JEFFREY DRUE·Filed 2011·Granted Mar 25, 2014·3 cites·16 claims
- 0875US11282755B2Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2019·Granted Mar 22, 2022·1 cites·14 claims
- 0975US2024087965A1Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1073US12343840B2Control of processing parameters for substrate polishing with substrate precessionAPPLIED MATERIALS INC·Filed 2022·Granted Jul 1, 2025·0 cites·17 claims
- 1172US11869815B2Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2022·Granted Jan 9, 2024·0 cites·13 claims
- 1269US2025108477A1Chemical mechanical polishing edge control with pad recessesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1368US2025114901A1Grooves for edge and hot spot compensation in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1468US2025114898A1Retaining ring for edge compensation by slurry flow controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1568US2025114897A1Edge and hot spot compensation techniques in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1660US8579675B2Methods of using optical metrology for feed back and feed forward process controlDAVID JEFFREY DRUE·Filed 2009·Granted Nov 12, 2013·0 cites·25 claims
- 1760US2024033878A1Minimizing substrate bow during polishingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1848US2009275265A1Endpoint detection in chemical mechanical polishing using multiple spectraAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 1945US2005095830A1Selective self-initiating electroless capping of copper with cobalt-containing alloysAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2039US2005136193A1Selective self-initiating electroless capping of copper with cobalt-containing alloysAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2138US2012034845A1Techniques for matching measured spectra to reference spectra for in-situ optical monitoringHU XIAOYUAN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →