Inventor · name-matched record
ARAI MASAYA
1 granted patent·2 pending applications·0 citations·filing 2023–2025
11Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0176US2026070162A1Solder alloy, solder paste, printed circuit board, and electronic control deviceTAMURA SEISAKUSHO KK·Filed 2025·Application pending·0 cites
- 0273US2026022466A1Film formation apparatus and maintenance method thereforTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0372US12569940B2Solder alloy, joint portion, joining material, solder paste, joint structure, and electronic control deviceTAMURA SEISAKUSHO KK·Filed 2023·Granted Mar 10, 2026·0 cites·15 claims
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Identity basis: exact name match across USPTO filings. How scoring works →