Merge mandrel features

Abstract

The present disclosure relates to semiconductor structures and, more particularly, to merged mandrel lines and methods of manufacture. The structure includes: at least one metal line having a first dimension in a self-aligned double patterning (SADP) line array; and at least one metal line having a second dimension inserted into the SADP line array, the second dimension being different than the first dimension.

What is claimed: 
     
       1. A structure comprising:
 at least one metal line having a first dimension in a self-aligned double patterning (SADP) line array; and 
 at least one metal line having a second dimension inserted into the SADP line array, the second dimension being different than the first dimension, 
 wherein the at least one metal line with the second dimension comprises a first metal line and a second metal line which are merged together by a metal bridge connecting the first metal line to the second metal line, and 
 wherein the at least one metal line with the first dimension is a single metal line wiring structure. 
 
     
     
       2. The structure of  claim 1 , wherein the second dimension is greater than the first dimension. 
     
     
       3. The structure of  claim 2 , wherein the second dimension includes at least a width of two metal lines having the first dimension and a space therebetween. 
     
     
       4. The structure of  claim 1 , wherein the second dimension of the metal line in the SADP line array is greater than 1× of a ground rule. 
     
     
       5. The structure of  claim 1 , wherein the first dimension and the second dimension correspond to different mandrel features. 
     
     
       6. The structure of  claim 5 , wherein the second dimension corresponds to a merged mandrel features in the SADP line array. 
     
     
       7. The structure of  claim 1 , wherein the SADP array includes additional metal lines that are of the first dimension. 
     
     
       8. The structure of  claim 7 , wherein, in the SADP array, the additional metal lines are on opposing side of the first metal line and the second metal line merged together by the metal bridge. 
     
     
       9. The structure of  claim 8 , wherein, in the SADP array, there are at least three metal lines with the first dimension. 
     
     
       10. The structure of  claim 9 , wherein, in the SADP array, further metal lines are alternating with the at least three metal lines with the first dimension. 
     
     
       11. The structure of  claim 7 , wherein the at least one metal line with the second dimension is a power rail which conducts electrical current. 
     
     
       12. The structure of  claim 11 , wherein the first metal line and the second metal line are parallel to one another within the SADP array. 
     
     
       13. The structure of  claim 12 , wherein the at least one metal line with the first dimension includes at least two metal wiring lines comprising a first metal wiring line within the SADP array and a second metal wiring line outside of the SADP array, both of which have a width of the first dimension.