Substrate and semiconductor apparatus

Abstract

There can be provided a substrate having a uniform and homogeneous insulating layer which does not generate unfastening or twisting of a fiber, and in addition to heat resistance, dimensional stability and impact resistance, having further excellent in bendability and flexibility.

What is claimed is: 
     
       1. A substrate which comprises
 a fiber film base material comprising a sheet of a surface-treated fiber film or a plural number of sheets of the surface-treated fiber films being laminated, 
 wherein the surface-treated fiber film has a value of a flexural rigidity measured by a method according to JIS R 3420 of 3-fold to 100-fold to a value of a flexural rigidity of a like fiber film before surface treatment, 
 wherein the surface-treated fiber film contains a glass fiber, and a part or all of the glass fiber is bundled and surface-treated by a cured product consisting essentially of an organosilicon compound, 
 wherein the organosilicon compound consists of one or more compounds selected from the group consisting of an alkoxysilane, a polysilazane and a partially hydrolyzed condensate thereof, and a silicone-modified varnish, where the silicone-modified varnish is at least one selected from the group consisting of an alkyd-modified varnish, a polyester-modified varnish, an epoxy-modified varnish, and an acryl-modified varnish, and 
 wherein an amount of the organosilicon compound attached to the fiber film is from 2% by mass to 90% by mass, based on 100% by mass of the surface-treated fiber film. 
 
     
     
       2. The substrate according to  claim 1 , wherein the substrate contains a white pigment. 
     
     
       3. The substrate according to  claim 1 , further comprising a metal layer(s) on one surface or both surfaces of the surface-treated fiber film or a laminate thereof. 
     
     
       4. The substrate according to  claim 2 , further comprising a metal layer(s) on one surface or both surfaces of the surface-treated fiber film or a laminate thereof. 
     
     
       5. The substrate according to  claim 1 , wherein the substrate is a substrate comprising a sheet of a prepreg using the surface-treated glass fiber film or a plural number of prepregs being laminated, and
 the prepreg is in an uncured state in which a thermosetting resin composition is coated onto the surface-treated glass fiber film and dried. 
 
     
     
       6. The substrate according to  claim 2 , wherein the substrate is a substrate comprising a sheet of a prepreg using the surface-treated glass fiber film or a plural number of prepregs being laminated, and
 the prepreg is in an uncured state in which a thermosetting resin composition is coated onto the surface-treated glass fiber film and dried. 
 
     
     
       7. The substrate according to  claim 3 , wherein the substrate is a substrate comprising a sheet of a prepreg using the surface-treated glass fiber film or a plural number of prepregs being laminated, and
 the prepreg is in an uncured state in which a thermosetting resin composition is coated onto the surface-treated glass fiber film and dried. 
 
     
     
       8. The substrate according to  claim 4 , wherein the substrate is a substrate comprising a sheet of a prepreg using the surface-treated glass fiber film or a plural number of prepregs being laminated, and
 the prepreg is in an uncured state in which a thermosetting resin composition is coated onto the surface-treated glass fiber film and dried. 
 
     
     
       9. The substrate according to  claim 3 , wherein the metal layer is formed by either of metal plating, a metal foil or a metal plate. 
     
     
       10. The substrate according to  claim 4 , wherein the metal layer is formed by either of metal plating, a metal foil or a metal plate. 
     
     
       11. The substrate according to  claim 3 , further comprising an adhesive resin composition between the surface-treated fiber film and the metal layer(s) or between the surface-treated fiber films with each other, or both of these. 
     
     
       12. The substrate according to  claim 4 , further comprising an adhesive resin composition between the surface-treated fiber film and the metal layer(s) or between the surface-treated fiber films with each other, or both of these. 
     
     
       13. The substrate according to  claim 11 , wherein the adhesive resin composition is thermosetting. 
     
     
       14. The substrate according to  claim 12 , wherein the adhesive resin composition is thermosetting. 
     
     
       15. The substrate according to  claim 1 , further comprising a material prepared by further superimposing a prepreg base material comprising at least one sheet of a prepreg(s) in an uncured state in which a thermosetting resin composition has been impregnated into the base material and dried being laminated with the fiber film base material, and at least one of the surface-treated fiber film and the prepreg contains a white pigment. 
     
     
       16. The substrate according to  claim 15 , wherein the substrate comprises the fiber film base material and the prepreg base material which are alternately superimposed. 
     
     
       17. The substrate according to  claim 15 , wherein the substrate comprises each two or more sheets of the fiber film base materials and the prepreg base materials being laminated. 
     
     
       18. The substrate according to  claim 16 , wherein the substrate comprises each two or more sheets of the fiber film base materials and the prepreg base materials being laminated. 
     
     
       19. The substrate according to  claim 5 , wherein the thermosetting resin composition is a silicone resin composition. 
     
     
       20. The substrate according to  claim 19 , wherein the silicone resin composition comprises the following Components (A) to (C):
 (A) an organopolysiloxane represented by the following average composition formula,
   (SiO 2 ) a (R 1   1-m R 2   m SiO 1.5 ) b (R 1   2-n R 2   n SiO) c (R 1   3-L R 2   L SiO 0.5 ) d    
 wherein R 1  represents a monovalent saturated hydrocarbon group having 1 to 10 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R 2  represents a monovalent unsaturated hydrocarbon group having 2 to 8 carbon atoms; m=0 to 1, n=0 to 2, L=0 to 3, and 1≤m+n+L≤6, and “a”, “b”, “c” and “d” are each numbers satisfying 0≤a≤1, 0≤b≤1, 0≤c≤0.9, 0≤d≤0.9, a+b>0, and a+b+c+d=1, 
 
 (B) a hydrogen polysiloxane containing one or more hydrosilyl groups, and 
 (C) a platinum based catalyst with an amount effective for curing. 
 
     
     
       21. The substrate according to  claim 5 , wherein the thermosetting resin composition contains a filler. 
     
     
       22. The substrate according to  claim 1 , wherein the surface-treated fiber film contains a filler. 
     
     
       23. The substrate according to  claim 21 , wherein the filler contains a white pigment. 
     
     
       24. The substrate according to  claim 22 , wherein the filler contains a white pigment. 
     
     
       25. The substrate according to  claim 1 , wherein the substrate is a substrate which is bendable at 90° or more. 
     
     
       26. A semiconductor apparatus which is prepared by using the substrate according to  claim 1 . 
     
     
       27. The substrate according to  claim 1 , wherein the amount of the organosilicon compound attached to the fiber film is from 4.5% by mass to 70% by mass, based on 100% by mass of the surface-treated fiber film. 
     
     
       28. The substrate according to  claim 1 , wherein the organosilicon compound consists of one or more compounds selected from the group consisting of an alkoxysilane, and a polysilazane and a partially hydrolyzed condensate thereof. 
     
     
       29. The substrate according to  claim 1 , wherein the epoxy-modified varnish contains an epoxy group-containing alkoxysilane oligomer.