Lead frame and electronic component device

Abstract

There is provided a lead frame. The lead frame includes: a die pad; a lead terminal that is separated from the die pad and disposed around the die pad; and a resin layer that is formed between the die pad and the lead terminal so as to fix the die pad and the lead terminal. The resin layer has an opening portion that exposes at least a lower surface of the lead terminal.

What is claimed is: 
     
       1. A lead frame comprising:
 a die pad; 
 a lead terminal that is separated from the die pad and disposed around the die pad; and 
 a resin layer that is formed between the die pad and the lead terminal so as to fix the die pad and the lead terminal, 
 wherein the resin layer has an opening portion that exposes a side surface and a lower surface of the lead terminal so as to provide a clearance between a side wall of the opening portion and the side surface of the lead terminal. 
 
     
     
       2. The lead frame according to  claim 1 , wherein
 a side surface of the die pad has a first protrusion, 
 a side surface of the lead terminal has a second protrusion opposed to the first protrusion, and 
 the resin layer is located below the first protrusion and the second protrusion in a thickness direction of the lead frame. 
 
     
     
       3. The lead frame according to  claim 1 , further comprising:
 a metal bonding material that is formed to cover the lower surface and the side surface of the lead terminal. 
 
     
     
       4. An electronic component device comprising:
 a lead frame comprising:
 a die pad; 
 a lead terminal that is separated from the die pad and disposed around the die pad; 
 a resin layer that is formed between the die pad and the lead terminal so as to fix the die pad and lead terminal, wherein the resin layer has an opening portion that exposes a side surface and a lower surface of the lead terminal so as to provide a clearance between a side wall of the opening portion and the side surface of the lead terminal; and 
 a metal bonding material that is formed to cover the lower surface and the side surface of the lead terminal; 
 
 an electronic component that is disposed on the die pad and electrically connected to the lead terminal; and 
 a sealing resin that seals the lead frame and the electronic component. 
 
     
     
       5. The electronic component device according to  claim 4 , wherein
 a side surface of the die pad has a first protrusion, 
 a side surface of the lead terminal has a second protrusion opposed to the first protrusion, and 
 the resin layer is located below the first protrusion and the second protrusion in a thickness direction of the lead frame. 
 
     
     
       6. A lead frame comprising:
 a die pad; 
 a lead terminal that is separated from the die pad and disposed around the die pad; and 
 a resin layer that is formed between the die pad and the lead terminal so as to fix the die pad and the lead terminal, 
 wherein 
 the resin layer has an opening portion that exposes only a lower surface of the lead terminal, 
 the resin layer is formed to continuously extend from a side surface of the lead terminal to the lower surface of the lead terminal, 
 the side surface and the lower surface of the lead terminal are directly covered with the resin layer, and 
 a metal plating layer is provided on the lower surface of the lead terminal which is exposed from the opening portion. 
 
     
     
       7. The lead frame according to  claim 6 , wherein
 a side surface of the die pad has a first protrusion, 
 a side surface of the lead terminal has a second protrusion opposed to the first protrusion, and 
 the resin layer is located below the first protrusion and the second protrusion in a thickness direction of the lead frame. 
 
     
     
       8. An electronic component device comprising:
 a lead frame comprising:
 a die pad; 
 a lead terminal that is separated from the die pad and disposed around the die pad; and 
 a resin layer that is formed between the die pad and the lead terminal so as to fix the die pad and lead terminal, wherein the resin layer has an opening portion that exposes only a lower surface of the lead terminal; 
 
 an electronic component that is disposed on the die pad and electrically connected to the lead terminal; and 
 a sealing resin that seals the lead frame and the electronic component, 
 wherein 
 the resin layer is formed to continuously extend from a side surface of the lead terminal to the lower surface of the lead terminal, 
 the side surface and the lower surface of the lead terminal is directly covered with the resin layer, and 
 a metal plating layer is provided on the lower surface of the lead terminal which is exposed from the opening portion. 
 
     
     
       9. The electronic component device according to  claim 8 , wherein
 a side surface of the die pad has a first protrusion, 
 a side surface of the lead terminal has a second protrusion opposed to the first protrusion, and 
 the resin layer is located below the first protrusion and the second protrusion in a thickness direction of the lead frame. 
 
     
     
       10. The electronic component device according to  claim 8 , further comprising an electrically conductive ball that is connected to the lower surface of the lead terminal through the opening portion.